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Volumn 477, Issue , 1997, Pages 115-123
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Use of malonic acid in chemical-mechanical polishing (CMP) of tungsten
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ADDITIVES;
ADSORPTION;
ALUMINA;
CARBOXYLIC ACIDS;
CHEMICAL POLISHING;
COMPOSITION EFFECTS;
CRYSTAL IMPURITIES;
PARTICLES (PARTICULATE MATTER);
PH EFFECTS;
SLURRIES;
TUNGSTEN;
CHEMICAL MECHANICAL POLISHING;
ELECTROKINETIC MEASUREMENT;
MALONIC ACID;
ZETA POTENTIAL;
SEMICONDUCTOR DEVICE MANUFACTURE;
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EID: 0030655243
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (2)
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References (9)
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