Automatic visual inspection of solder joints on printed circuit boards

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 336, Issue , 1982, Pages 121-127

  Nakagawa, Yasuo ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATIC VISUAL INSPECTION; JOINT SHAPE; JUDGEMENT ALGORITHM; LIGHT-SECTION WAVEFORM EXTRACTION; SOLDER JOINTS; STRUCTURED LIGHT;

PRINTED CIRCUITS;

EID: 0020266725     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.933619     Document Type: Conference Paper

References (5)

1. Okada S., Welding Machine using Shape Detector, Mitsubishi-Denki-Giho, Vol. 47-2, pp. 157 (in Japanese), 1973.
2. Tsukada T., Sectional Shape Detection Aparatus, Japan Patent TKS S49-58864, 1974.
3. Takeshita M., Optical Rail Warp Measurement System, Japan Patent TKS S51-143358, 1978.
4. Taenser D., Progress Report on Visual Inspection of Solder Joints, MIT A.I.Lab., Working Paper No. 96, 1976.
5. Oshida Y., Moire Contour Map Display of Tiny Objects by Laser Interfringes, 27th Japan Applied Phisics Joint Conf., pp. 62, 1981.