A Tiered-Color Illumination Approach for Machine Inspection of Solder Joints

IEEE Transactions on Pattern Analysis and Machine Intelligence

Volumn 10, Issue 3, 1988, Pages 387-393

  Capson, David W ^a   Eng, Sai Kit ^a  

^a MCMASTER UNIVERSITY   (Canada)

Author keywords

Color illumination; color image processing; solder joint inspection; tiered lighting

Indexed keywords

SOLDERING - INSPECTION;

COLOR IMAGE PROCESSING; SOLDERING JOINTS; TIERED-COLOR ILLUMINATION;

VISION, COLOR;

EID: 0024016711     PISSN: 01628828     EISSN: None     Source Type: Journal    
DOI: 10.1109/34.3902     Document Type: Article

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