Post dry-etch cleaning issues of an organic low-K dielectric

Solid State Phenomena

Volumn 65-66, Issue , 1999, Pages 89-92

  Lanckmans, F ^a   Baklanov, M ^a   Alaerts, C ^a   Vanhaelemeersch, S ^a   Maex, K ^a,b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Organic dielectric; Residues; Wet strip

Indexed keywords

CHEMICAL STABILITY; DIELECTRIC MATERIALS; INDICATORS (CHEMICAL); DIELECTRIC DEVICES; DRY ETCHING; SCANNING ELECTRON MICROSCOPY; SURFACE CLEANING;

CLEANING SOLUTION; ISOPROPYL ALCOHOLS; ORGANIC DIELECTRICS; ORGANIC LOW-K; PEROXIDE MIXTURE; RESIDUES; WET STRIPS;

LOW-K DIELECTRIC; MICROPROCESSOR CHIPS;

WET STRIPS;

EID: 0032783933     PISSN: 10120394     EISSN: 16629779     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/SSP.65-66.89     Document Type: Conference Paper

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