Enhancement of C-49 to C-54 TiSi2 phase transformation on (001)Si with an ultrathin TiN seed layer

Applied Surface Science

Volumn 142, Issue 1, 1999, Pages 336-340

  Peng, Y C ^a   Chen, L J ^a   Hsieh, W Y ^b   Yang, Y R ^b   Hsieh, Y F ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b UNITED MICROELECTRONICS CORPORATION   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL STRUCTURE; GRAIN BOUNDARIES; NUCLEATION; SEMICONDUCTING SILICON; TITANIUM COMPOUNDS; TITANIUM NITRIDE;

FINE GRAINED STRUCTURE; ULTRATHIN SEED LAYER;

PHASE TRANSITIONS;

EID: 0032662586     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(98)00671-0     Document Type: Article

References (15)

1. Sinha A.K. Mater. Res. Soc. Symp. Proc. 54:1985;735.
2. Alperin M.E., Hollaway T.C., Haken R.A., Gosmeyer C.D., Karnaugh R.V., Parmantie W.D. IEEE Trans. Electron Devices. ED 32:1985;141.
3. Clevenger L.A., Mann R.W. Mater. Res. Soc. Symp. Proc. 320:1994;15.
4. Chen L.J., Cheng S.L., Tsai B.Y. Nucl. Instrum. Meth. B. 121:1997;231.
5. Ma Z., Allen L.H. Phys. Rev. B. 49:1994;13501.
6. Ma Z., Allen L.H., Allman D.D.J. Thin Solid Films. 253:1994;451.
7. Mouroux A., Zhang S.-L., Kaplan W., Nygren S., Ostling M., Petersson C.S. Appl. Phys. Lett. 69:1996;975.
8. Mann R.W., Miles G.L., Kotts T.A., Rakowski D.W., Clevenger L.A., Harper J.M.E., D'Heurle F.M., Cabral C. Jr. Appl. Phys. Lett. 67:1996;3729.
9. Li X.-H., Carlsson R.A., Gong S.F., Hentzell H.T.G. J. Appl. Phys. 72:1992;514.
10. Salvi V.P., Vidwans S.V., Rangwala A.A., Arora B.M., Kuldeep, Jain A.K. Nucl. Instrum. Meth. B. 28:1987;242.
11. Revesz P., Gyimesi J., Zsoldos E. J. Appl. Phys. 54:1983;1860.
12. Chen C.C., Wang Q.F., Jonckx F., Jenq J.S., Maex K. Mater. Res. Soc. Symp. Proc. 402:1996;89.
13. Kitano T., Kodama N., Sakai T., Saito S. Jpn. J. Appl. Phys. 35:1996;591.
14. Ma Z., Ramanath G., Alien L.H. Mater. Res. Soc. Proc. 320:1994;361.
15. van Houtum H.J.W., Raaijmakers I.J.M.M., Menting T.J.M. J. Appl. Phys. 61:1987;3116.