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Volumn 568, Issue , 1999, Pages 19-30

Ultra-shallow junctions by ion implantation and rapid thermal annealing: Spike-anneals, ramp rate effects

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION IN SOLIDS; ION IMPLANTATION; RAPID THERMAL ANNEALING; SEMICONDUCTING BORON;

EID: 0032644936     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-568-19     Document Type: Article
Times cited : (21)

References (19)
  • 6
    • 0345758576 scopus 로고    scopus 로고
    • ed. H.R. Huff, U. Goselle, and H. Tsuya, ECS Proc.
    • H.-J. Gossmann, in Semiconductor Silicon, ed. H.R. Huff, U. Goselle, and H. Tsuya, ECS Proc. Vol. 98-1, 884 (1998).
    • (1998) Semiconductor Silicon , vol.98 , Issue.1 , pp. 884
    • Gossmann, H.-J.1
  • 12
    • 33751131173 scopus 로고    scopus 로고
    • note
    • In all simulations of implanted dopant diffusion, the interaction of dopants with damage was included in the form of a "plus" number of interstitials which form clusters and dissolve (see Reference 12). No boron-interstitial clusters were included. Boron is active only up to its solid-solubility in silicon.
  • 16
    • 33751126821 scopus 로고    scopus 로고
    • Meeting, San Francisco
    • S. Saito, presented at MRS Spring 1998 Meeting, San Francisco.
    • (1998) MRS Spring
    • Saito, S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.