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Volumn 47, Issue 9, 1999, Pages 2777-2785
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Debonding behavior between β-Si3N4 whiskers and oxynitride glasses with or without an epitaxial β-SiAlON interfacial layer
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Author keywords
[No Author keywords available]
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Indexed keywords
ADDITIVES;
ALUMINUM;
BOND STRENGTH (CHEMICAL);
CALCULATIONS;
CRYSTAL WHISKERS;
DENSIFICATION;
FRACTURE TOUGHNESS;
GLASS;
OXYGEN;
RESIDUAL STRESSES;
SILICON COMPOUNDS;
SILICON NITRIDE;
DEBONDING STRENGTH;
EPITAXIAL LAYER;
FIRST PRINCIPLES ATOMIC CLUSTER CALCULATIONS;
FRACTURE RESISTANCE;
INTERGRANULAR GLASS;
OXYNITRIDE GLASSES;
THERMAL MECHANICAL MISMATCH;
INTERFACES (MATERIALS);
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EID: 0032628990
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/S1359-6454(99)00122-6 Document Type: Article |
Times cited : (81)
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References (31)
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