Substrate composition effects on the interfacial fracture of tantalum nitride films

Journal of Materials Research

Volumn 14, Issue 6, 1999, Pages 2306-2313

  Moody, N R ^a   Strojny, A ^b   Medlin, D L ^a   Talin, A ^c   Gerberich, W W ^b  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b UNIVERSITY OF MINNESOTA   (United States)

^c MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPOSITION EFFECTS; COMPRESSIVE STRESS; ELASTIC MODULI; FRACTURE MECHANICS; INTERFACES (MATERIALS); INTERFACIAL ENERGY; MECHANICAL TESTING; NANOSTRUCTURED MATERIALS; RESIDUAL STRESSES;

INTERFACIAL FRACTURE; NANOINDENTATION TESTS; TANTALUM NITRIDE;

TANTALUM COMPOUNDS;

EID: 0032626196     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1999.0307     Document Type: Article

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