Dry release of metal structures in oxygen plasma: Process characterization and optimization

Journal of Micromechanics and Microengineering

Volumn 8, Issue 2, 1998, Pages 91-94

  Bartek, M ^a   Wolffenbuttel, R F ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ETCHING; INTEGRATED CIRCUIT MANUFACTURE; MICROMACHINING; OXYGEN; PHOTORESISTS; PLASMA APPLICATIONS; SILICON WAFERS;

DRY RELEASE TECHNIQUE; ISOTROPIC OXYGEN PLASMA; WET ETCHING;

MICROELECTRONIC PROCESSING;

EID: 0032092691     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/8/2/012     Document Type: Article

References (7)

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7. Elliot D J 1986 Microlithography: Process Technology for IC Fabrication (New York: McGraw-Hill)