Understanding and controlling wafer charging damage

Solid State Technology

Volumn 41, Issue 6, 1998, Pages 101-112

  Lukaszek, Wes ^a  

^a Wafer Charging Monitors Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CHARGE; ELECTRIC CURRENTS; SEMICONDUCTOR DEVICE MODELS;

WAFER CHARGING DAMAGES;

SILICON WAFERS;

EID: 0032083841     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (13)

1. Plasma Process Induced Damage (P2ID) Conferences.
2. W.L. Abdel-Ati, et al., "Measurement Strategy for Plasma Charging Induced Damage," Electrochemical Society Proceedings, PV95-5, pp. 410-417, 1995.
3. S. Fang, S. Murakawa, J.P. McVittie, "Modeling of Oxide Breakdown from Gate Charging During Resist Ashing," IEEE Trans. on Electron Devices, Vol. 41, No. 10, pp. 1848-1855, Oct. 1994.
4. S. Ma, J.P. McVittie, K.C. Saraswat, "Prediction of Plasma Charging Induced Gate Oxide Damage by Plasma Charging Probe," IEEE Electron Device Letters, Vol. 18, No. 10, pp. 468-470, Oct. 1997.
5. B.J. Doherty, D.J. McCarron, "Ion Induced Wafer Charging," Nuclear Instruments and Methods B37/38, pp. 559-562, 1989.
6. M.C. Vella, et al., "Plasma Model for Charging Damage," Nuclear Instruments and Methods in Physics Research B96, pp. 48-51, 1995.
7. W. Chang, Eaton Corporation, personal communication.
8. W. Lukaszek, et al., "Masked-photoresist charging effects during Arsenic implants," GSVIIUG meeting, March 19, 1997.
9. W. Lukaszek, A. Birrell, "Quantifying Wafer Charging During Via Etch," 1st International Symposium on Plasma Process Induced Damage, Santa Clara, CA, pp. 30-33, May 1996.
10. K. Hashimoto, et al., "Reduction of the charging damage from electron shading," 1st International Symposium on Plasma Process Induced Damage, Santa Clara, CA, pp. 30-33, May 1996.
11. W. Lukaszek, J. Shields, A. Birrell, "Quantifying Via Charging Currents," 2nd International Symposium on Plasma Process Induced Damage, Monterey, CA, pp. 123-126, May 1997.
12. R. Patrick, et al., "Study of Pattern Dependent Charging in a High-density, Inductively Coupled Metal Etcher," 2nd International Symposium on Plasma Process Induced Damage, Monterey, CA, pp. 59-62, May 1997.
13. W. Lukaszek, "The Fundamentals of CHARM-2," available from Wafer Charging Monitors Inc., 127 Marine Road, Woodside, CA 94062.