Quantifying wafer charging during via etch

International Symposium on Plasma Process-Induced Damage, P2ID, Proceedings

Volumn , Issue , 1996, Pages 30-33

  Lukaszek, Wes ^a   Birrell, Andrew H ^a  

^a Wafer Charging Monitors Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTRIC CHARGE; ELECTRIC FIELD EFFECTS; ELECTRODES; PHOTORESISTS; PLASMA ETCHING; PROM; SENSORS; SURFACE PHENOMENA; TRANSISTORS;

CHARGE COLLECTION ELECTRODE; VIA ETCH PROCESS; WAFER; WAFER CHARGING;

SEMICONDUCTOR DEVICES;

EID: 0029719125     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)