Analysis of Iddq failures by spectral photon emission microscopy

Microelectronics Reliability

Volumn 38, Issue 6-8, 1998, Pages 877-882

  Rasras, M ^a   De Wolf, I ^a   Bender, H ^a   Groeseneken, G ^a   Maes, H E ^a   Vanhaeverbeke, S ^b   De Pauw, P ^b  

^a IMEC   (Belgium)

^b LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC BREAKDOWN OF SOLIDS; ELECTRIC DISCHARGES; ELECTROSTATICS; EMISSION SPECTROSCOPY; ION BEAMS; MICROPROCESSOR CHIPS; PHOTONS;

FOCUSED ION BEAM (FIB) TECHNIQUE;

INTEGRATED CIRCUIT TESTING;

EID: 0032083623     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2714(98)00106-1     Document Type: Article

References (6)

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4. K. de Kort and P. Damink. Proc. ESREF, pp. 45-52, 1990.
5. M. Rasras, I. De Wolf, G. Groeseneken, H. E. Maes, S. Vanhaeverbeke, P. De Pauw. Proc. ISTFA Symp. 1997, pp. 153-157, Santa Clara, USA.
6. M. Rasras, I. De Wolf, G. Groeseneken, H. E. Maes. Microelectronics and reliability. Vol. 37: pp. 1595-1598; 1997.