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Volumn 36, Issue 12 A, 1997, Pages 7302-7306

Preparation of Cu10Zr7 intermetallic compound film and its application as a diffusion barrier in Cu/Cu10Zr7/ZrN/Si contact system

Author keywords

Cu metallization; Cu10Zr7 intermetallic compound; Diffusion barrier; LSI contact structure; Metal semiconductor interface

Indexed keywords

COPPER COMPOUNDS; DIFFUSION; INTERMETALLICS; SPUTTERING; STOICHIOMETRY; THERMODYNAMIC STABILITY; X RAY DIFFRACTION; ZIRCONIUM COMPOUNDS;

INTERMETALLIC COMPOUND FILM; SOLID PHASE REACTION;

FILM PREPARATION;

EID: 0031361936 PISSN: 00214922 EISSN: None Source Type: Journal
DOI: 10.1143/jjap.36.7302 Document Type: Article

Times cited : (3)

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