Characterization of thermal device properties with nanometer resolution

Microelectronics Reliability

Volumn 37, Issue 10-11, 1997, Pages 1583-1586

  Cramer, R M ^a   Bruchhaus, L ^a   Balk, L J ^a  

^a UNIVERSITY OF WUPPERTAL   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC PROPERTIES; MICROSCOPIC EXAMINATION; PROBES; TEMPERATURE; TEMPERATURE MEASUREMENT; THERMAL DIFFUSION; THERMODYNAMIC PROPERTIES; TRANSISTORS;

SCANNING THERMAL MICROSCOPY; THERMAL DIFFUSIVITY;

INTEGRATED CIRCUITS;

EID: 0031250793     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(97)00115-7     Document Type: Article

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