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Volumn 43, Issue 9, 1995, Pages 940-948

Advanced Ceramic Packaging for Microwave and Millimeter Wave Applications

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; INTEGRATED CIRCUITS; MICROWAVES; MILLIMETER WAVES; MULTICHIP MODULES; MULTILAYERS; RESONANCE; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTOR DEVICES; WAVEGUIDES;

EID: 0029378307     PISSN: 0018926X     EISSN: 15582221     Source Type: Journal    
DOI: 10.1109/8.410210     Document Type: Article
Times cited : (7)

References (11)
  • 4
    • 0027040850 scopus 로고
    • Microwave module interconnection and packaging using multilayer thin film/thick film technology
    • Albuquerque, NM, June 1-5
    • A. K. Agrawal, R. D. Clark, and J. J. Komiak, “Microwave module interconnection and packaging using multilayer thin film/thick film technology,” in 1992 IEEE MTT-S Int. Microwave Symp. Dig., Albuquerque, NM, June 1-5, 1992, pp. 1509-1511.
    • (1992) 1992 IEEE MTT-S Int. Microwave Symp. Dig. , pp. 1509-1511
    • Agrawal, A.K.1    Clark, R.D.2    Komiak, J.J.3
  • 5
    • 0026374606 scopus 로고
    • Design and performance of octave S/C-band MMIC T/R modules for multi-function phased arrays
    • Dec.
    • J. J. Komiak and A. K. Agrawal, “Design and performance of octave S/C-band MMIC T/R modules for multi-function phased arrays,” IEEE Trans. Microwave Theory Techniques, vol. 39, no. 12, pp. 1955-1963, Dec. 1991.
    • (1991) IEEE Trans. Microwave Theory Techniques , vol.39 , Issue.12 , pp. 1955-1963
    • Komiak, J.J.1    Agrawal, A.K.2
  • 6
    • 43549091783 scopus 로고
    • High-efficiency 20 watt S/C-band power amplifier MMIC
    • Miami Beach, FL, Oct. 4-7
    • J. J. Komiak, “High-efficiency 20 watt S/C-band power amplifier MMIC,” in Technical Dig. 1992 IEEE GaAs IC Symp., Miami Beach, FL, Oct. 4-7, 1992, pp. 187-190.
    • (1992) Technical Dig. 1992 IEEE GaAs IC Symp. , pp. 187-190
    • Komiak, J.J.1
  • 7
    • 0027794818 scopus 로고
    • Microwave and millimeter-wave packaging and interconnection methods for single and multiple chip modules
    • San Jose, CA, Oct. 10-13
    • D. Wein, P. Anderson, J. Babiarz, J. Carter, N. Fulinara, and M. Goetz, “Microwave and millimeter-wave packaging and interconnection methods for single and multiple chip modules,” in 1993 IEEE GaAs IC Symp. Technical Dig., San Jose, CA, Oct. 10-13, 1994, pp. 333-336.
    • (1994) 1993 IEEE GaAs IC Symp. Technical Dig. , pp. 333-336
    • Wein, D.1    Anderson, P.2    Babiarz, J.3    Carter, J.4    Fulinara, N.5    Goetz, M.6
  • 11
    • 0027812597 scopus 로고
    • Multi-element multi-layer packaging for phased array antenna applications
    • Ann Arbor, MI, June 28-July 2
    • K. A. Shalkhauser, M. P. Goetz, and P. M. Anderson, “Multi-element multi-layer packaging for phased array antenna applications,” in Proc. IEEE Antennas Propagat. Soc. Int. Symp., Ann Arbor, MI, June 28-July 2, 1993, pp. 1009-1012.
    • (1993) Proc. IEEE Antennas Propagat. Soc. Int. Symp. , pp. 1009-1012
    • Shalkhauser, K.A.1    Goetz, M.P.2    Anderson, P.M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.