Analysis of complex electronic packages with the use of using the FDTD/touchstone hybrid technique

Microwave and Optical Technology Letters

Volumn 12, Issue 6, 1996, Pages 313-315

  Chen, Yinchao ^a   Harms, Paul ^b   Mittra, Raj ^c   Beyene, Wendemagegnehu ^c  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b UNIVERSITY OF KENTUCKY   (United States)

^c University of Illinois at Urbana Champaign   (United States)

Author keywords

Complex electronic packages; Finite difference time domain method; TOUCHSTONE

Indexed keywords

ALGORITHMS; COMPUTER SIMULATION; COMPUTER SOFTWARE; ELECTROMAGNETIC FIELDS; EQUIVALENT CIRCUITS; FINITE DIFFERENCE METHOD; MODELS; PLASTICS; PLASTICS APPLICATIONS; SEMICONDUCTING SILICON; TIME DOMAIN ANALYSIS;

COMPLEX ELECTRONIC PACKAGES; FINITE DIFFERENCE TIME DOMAIN; FREQUENCY DEPENDENT ANALYSIS; SILICON ON PLASTIC; SOFTWARE PACKAGE TOUCHSTONE;

ELECTRONICS PACKAGING;

EID: 0030212358     PISSN: 08952477     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1098-2760(19960820)12:6<313::AID-MOP3>3.0.CO;2-I     Document Type: Article

References (8)

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8. TOUCHSTONE, EEsof, Inc., 5795 Lindero Canyon Rd., Westlake Village, CA 91362.