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Three-dimensional MMIC technology for multifunction integration and its possible application to masterslice MMIC
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Tokumitsu, T.1
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2
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0029409137
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Three dimensional MMIC technology: A possible solution to masterslice MMIC's on GaAs and Si
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Nov
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T. Tokumitsu, M. Aikawa, and K. Kohlyama, "Three dimensional MMIC technology: A possible solution to masterslice MMIC's on GaAs and Si," IEEE Microwave and Guided Wave Letters, Vol. 5, No. 11, pp. 411-413, Nov. 1995
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Tokumitsu, T.1
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3
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84897529579
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Multilayer MMIC branch-line coupler and broad-side coupler
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Toyoda, T. Hiraoka, T. Hirota, and T. Tokumitsu, "Multilayer MMIC branch-line coupler and broad-side coupler," in Proc. The IEEE 1992 Microwave and Millimeter-Wave Monolithic Circuits Symposium, pp. 7982
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Hiraoka, T.T.1
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5
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0029509348
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Three dimensional passive circuit technology for ultra-compact MMIC's
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Dec
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6
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0007972004
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Multilayer MMIC using a 3 ±m x N-layer dielectric film structure
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June
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T. Tokumitsu, T. Hiraoka, H. Nakamoto, and M. Aikawa, "Multilayer MMIC using a 3 ±m x N-layer dielectric film structure," IEICE Trans. Electron. , Vol. E75-C, No. 6, pp. 698-706, June 1992
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Tokumitsu, T.1
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7
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0347632755
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Highly-integrated three-dimensional MMIC 20-GHz single-chip receiver
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K. Nishikawa, K. Kamogawa, T. Tokumitsu, M. Hirano, S. Sugitani, and M. Aikawa, "Highly-integrated three-dimensional MMIC 20-GHz single-chip receiver," in Proc. The 26th European Microwave Conference.
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Nishikawa, K.1
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