Thermally-enhanced SOIC packages for power IC devices

IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD)

Volumn , Issue , 1996, Pages 313-316

  Chowdhury, Asif ^a   Guenin, Bruce M ^a   Groover, Richard ^a   Anderson, Steve ^a   Derian, Edward J ^a  

^a Amkor Electronics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUITS; SEMICONDUCTOR DEVICE MODELS; THERMODYNAMIC PROPERTIES;

THERMAL MODELS; THERMALLY ENHANCED SEMICONDUCTOR PACKAGES;

POWER ELECTRONICS;

EID: 0029709659     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)