Parametric FEA thermal model for QFP packages

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1996, Pages 105-110

  Lall, Balwant S ^a   Guenin, Bruce M ^a   Marrs, Robert C ^a   Molnar, Ronald J ^a  

^a Amkor Electronics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; ELECTRIC VARIABLES MEASUREMENT; FINITE ELEMENT METHOD; GEOMETRY; HEAT TRANSFER; PRINTED CIRCUIT BOARDS; SURFACES; THERMAL CONDUCTIVITY;

COMPUTER MODELS; PACKAGE GEOMETRY;

ELECTRONICS PACKAGING;

EID: 0029709664     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)