Thermal diffusivity measurement of polymeric thin films using the photothermal displacement technique. II. On-wafer measurement

Journal of Applied Physics

Volumn 86, Issue 11, 1999, Pages 6028-6038

  Hu, Chuan ^a   Ogawa, Ennis T ^b   Ho, Paul S ^b  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^b The University of Texas at Austin   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0013331111     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.371650     Document Type: Article

References (24)

1. Semiconductor Industry Association (SIA), The National Technology Roadmap for Semiconductors (SIA, San Jose, CA, 1997).
2. W. W. Lee and P. S. Ho, Mater. Res. Bull. 22, 19 (1997).
3. J. A. Rogers, C. Mindas, Y. Yang, and K. A. Nelson, Mater. Res. Soc. Symp. Proc. 323, 441 (1994).
4. J. C. Lambropoulos, M. R. Jolly, C. A. Amsden, S. E. Gilman, M. J. Sinicropi, D. Diakomihalis, and S. D. Jacobs, J. Appl. Phys. 66, 4230 (1989).
5. E. T. Swartz and R. O. Pohl, Rev. Mod. Phys. 61, 605 (1989).
6. M. A. Olmstead, S. E. Kohn, and N. M. Amer, Bull. Am. Phys. Soc. 27, 227 (1982).
7. M. A. Olmstead, N. M. Amer, S. Kohn, D. Fournier, and A. C. Boccara, Appl. Phys. A: Solids Surf. 32, 141 (1983).
8. J. Opsal, A. Rosencwaig, and D. L. Willenborg Appl. Opt. 22, 3169 (1983).
9. A. Rosencwaig, J. Opsal, W. L. Smith, and D. L. Willenborg, Appl. Phys. Lett. 46, 1013 (1985).
10. E. T. Ogawa, C. Hu, and P. S. Ho, J. Appl. Phys. 86, 6018 (1999).
11. G. Langer, J. Hartmann, and M. Reichling, Rev. Sci. Instrum. 68, 1510 (1997).
12. M. Reichling and H. Gronbeck, J. Appl. Phys. 75, 1914 (1994).
13. S. T. Chen, Mater. Res. Soc. Symp, Proc. 381, 141 (1995).
14. J. H. Lau and Y. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies (McGraw-Hill, New York, 1997), pp. 115-120.
15. W. Nowacki, Thermoelasticity (Pergamon, New York, 1975); M. N. Ozisik, Heat Conduction (Wiley, New York, 1980).
16. W. Nowacki, Thermoelasticity (Pergamon, New York, 1975); M. N. Ozisik, Heat Conduction (Wiley, New York, 1980).
17. A. Ocaritz, A. Sanchez-Lavega, A. Salazar, D. Fournier, and A. C. Boccara, J. Appl. Phys. 80, 2968 (1996).
18. C. Christofides, F. Diakonos, A. Seas, C. Christou, M. Nestoros, and A. Mandelis, J. Appl. Phys. 80, 1713 (1996).
19. S. M. Sze, Physics of Semiconductor Devices, 2nd ed. (Wiley, New York, 1981), p. 851.
20. C. Jin, L. Ting, K. Taylor, T. Seha, and J. D. Luttmer, Proceedings of the Second International Dielectrics for VLSI/ULS1 Multilevel Interconnection Conference (DUMIC), Feb. 20-21, 1996.
21. S. M. Lee and D. G. Cahill, J. Appl. Phys. 81, 2590 (1997).
22. K. Kurabayashi, M. Touzelbaev, M. Asheghi, Y. S. Ju, and K. E. Goodsen, Proceedings of the AIAA/ASME Joint Thermophysics and Heat Transfer Conference, Albuquerque, NM, June 5-18, 1998.
23. B. S. W. Kuo, J. C. M. Li, and A. W. Schmid, Appl. Phys. A: Solids Surf. 55, 289 (1992).
24. J. C. Lambropoulos, M. R. Jolly, C. A. Amsden, S. E. Gilman, M. J. Sinicropi, D. Diakomihalis, and S. D. Jacobs, J. Appl. Phys. 66, 4230 (1989).