Material structure and processes required for the manufacture of micromechanical devices

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3223, Issue , 1997, Pages 230-236

  Skrobis, K ^a   Christenson, J ^a   Staller, S ^a   Freeman, J ^a   Gadgil, P ^b  

^a DELPHI CORPORATION   (United States)

^b LUCENT TECHNOLOGIES   (United States)

Author keywords

Deep anisotropic etching; LIGA; Polysilicon

Indexed keywords

APPLICATION AREAS; CRYSTAL SILICONS; DEEP ANISOTROPIC ETCHING; ECONOMIC POTENTIALS; EXCITING FIELDS; KNOWLEDGE AND EXPERIENCES; LIGA; LIGA PROCESSES; MANUFACTURING FACILITIES; MATERIAL STABILITIES; MATERIAL STRUCTURES; MICROMECHANICAL DEVICES; MICROMECHANICAL PROCESSES; POLYSILICON SENSORS; PRIMARY SENSORS; PROCESS FLEXIBILITIES; PRODUCT MANUFACTURABILITY; RESEARCH GROUPS; SENSOR FABRICATIONS; SENSOR MATERIALS;

ANISOTROPY; AUTOMOTIVE INDUSTRY; COMPOSITE MICROMECHANICS; ETCHING; MACHINING; MICROANALYSIS; MICROFABRICATION; MICROMACHINING; POLYSILICON; SENSORS; SILICON SENSORS; SILICON WAFERS; SINGLE CRYSTALS;

ANISOTROPIC ETCHING;

EID: 0007621148     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.284485     Document Type: Conference Paper

References (19)

1. French and Evans. "Polycrystalline Silicon Strain Sensors", Sensors and Actuators, 8, pp. 219-225, 1985.
2. H. Guckel, D. W. Burns, C. C. G. Visser, H. A. C. Tilmann, D. DeRoo, "Fine-Grained Polysilicon Films with Built-in Tensile Strain," IEEE Trans. on Elect. Dev., ED-35 (6), pp. 800-801, June 1988.
3. L. J. Ristic, R. Gutteridge, B. Dunn, D. Mietus, and P. Bennett, "Surface Micromachined Polysilicon Accelerometer," IEEE Solid-State Sensor and Actuator Workshop, June 22-25, pp. 118-121, 1992.
4. U. Srinivasan, M. R. Houston, R. T. Howe, and R. Maboudian, "Self-Assembled Flourocarbon Films For Enhanced Stiction Reduction," Transducers '97, June 16-19, pp. 1399-1402, 1997.
5. K. Tsujimoto, S. Tachi, and S. Okudaira, Proceedings of the 9th Symposium Dry Process, Tokyo, 1988, p. 42 and Extended Abstracts of the 20th conference on Solid State Devices and Materials, Tokyo, p. 553, 1988.
6. Alcatel Comptech, 550 Parrot Street, San Jose, CA 95112, USA.
7. Plasma-Therm, 10050 16th Street North, St. Petersburg, FL 33716, USA.
8. Surface Technology Systems, Prince of Wales Industrial Estate, Abercarn, Gwent NP1 5AR, UK.
9. K. Wang, A.-C. Wong, W.-T. Hsu, and C. T.-C. Nguyen, "Frequency Trimming and Q-Factor Enhancement of Micromechanical Resonators Via Localized Filament Annealing," Transducers '97, June 16-19, pp. 109-112, 1997.
10. J. T. Butler, V. M. Bright, and J. H. Comtois, "Advanced Multichip Module Packaging of Microelectromechanical Systems," Transducers '97, June 16-19, pp. 261-264, 1997.
11. G. Guckel, K. J. Skrobis, T. R. Christenson, J. Klein, S. Han, B. Choi, E. G. Lovell, and T. W. Chapman, "Fabrication and Testing of the Planar Magnetic Micromotor," J. of Micromechanics and Microengineering, 1 (4), pp. 135-138, 1991.
12. B. Choi, E. G. Lovell, H. Guckel, T. R. Christenson, K. J. Skrobis, J. W. Kang, "Development of Pressure Transducers Utilizing Deep X-ray Lithography." Transducers '91, June 24-27, pp. 393-396, 1991.
13. H. Guckel, J. Klein, T. Christenson, K. Skrobis, M. Laudon, E. G. Lovell, "Thermo-Magnetic Metal Flexure Actuators," Solid-State Sensor and Actuator Workshop, June 22-25, pp. 73-75, 1992.
14. G. Guckel, K. J. Skrobis, T. R. Christenson, J. Klein, S. Han, B. Choi, E. G. Lovell, and T. W. Chapman, "Fabrication and Testing of the Planar Magnetic Micromotor," J. of Micromechanics and Microengineering, 1 (4), pp. 135-138, 1991.
15. R. Venkatraman, J. C. Bravman, and W. D. Nix, "Mechanical Properties and Microstructural Characterization of Al- 0.5%Cu Thin Films," Journal of Electronic Materials, 19 (11), pp. 1231-1237, 1990.
16. C. A. Pico, and T. D. Bonifield, "Microstructural Characterization of Al 98.5 wt.%, Si 1.0 wt.%, Cu 0.5 wt.% on Chemical- Vapor-Deposited W," J. Mater. Res., 8 (5), p. 1001, 1993.
17. R. Venkatraman, P. R. Besser, J. C. Bravman, and S. Brennan, "Elastic Strain Gradients and X-ray Line Broadening Effects as a Function of Temperature in Aluminum Thin Films on Silicon," J. Mater. Res., 9 (2), pp. 328-335, 1994.
18. S. Bader, E. M. Kalaugher, and E. Arzt, "Comparison of Mechanical Properties and Microstructure of Al(1 wt.% Si) and Al(1 wt.% Si, 0.5 wt.% Cu) Thin Films," Thin Solid Films, 263, pp. 175-184, 1995.
19. L. Parameswaran, C. H. Hsu, and M. A. Schmidt, "IC Process Compatibility of Sealed Cavity Sensors," Transducers '97, Chicago, June 16-19, pp. 625-628, 1997.