IC process compatibility of sealed cavity sensors

International Conference on Solid-State Sensors and Actuators, Proceedings

Volumn 1, Issue , 1997, Pages 625-628

  Parameswaran, Lalitha ^a   Hsu, Charles H ^a   Schmidt, Martin A ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CMOS INTEGRATED CIRCUITS; MATHEMATICAL MODELS; STRESS ANALYSIS;

SEALED CAVITY SENSORS; WAFER BONDING;

SENSORS;

EID: 0030691362     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)