Top surface imaging process at and below quarter-micron resolution and pattern transfer into metal

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 15, Issue 6, 1997, Pages 2605-2609

  Irmscher, Mathias ^a   Höfflinger, Bernd ^a   Reuter, Christian ^a   Springer, Reinhard ^a   Stauffer, Craig ^b   Puttock, Mark ^c  

^a Institut fur Mikroelektronik Stuttgart   (Germany)

^b GENESIS   (United States)

^c Electrotech   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0005011746     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.589693     Document Type: Article

References (7)

1. T. H. P. Chang, M. G. R. Thomson, E. Kratschmer, H. S. Kim, M. L. Yu, K. Y. Lee, S. A. Rishton, and B. W. Hussey, J. Vac. Sci. Technol. B 14, 3774 (1996).
2. D. Wheeler, R. Hutton, C. Boyce, S. Stein, R. Cirelli, and G. Taylor, Proc. SPIE 2438, 762 (1995).
3. M. Irmscher, B. Höfflinger, R. Springer, C. Stauffer, and W. Peterson, Proc. SPIE 2724, 564 (1996).
4. G. S. Calabrese, J. F. Bohland, E. F. Pavelchek, R. Sinta, B. W. Dudley, S. K. Jones, and P. W. Freeman, Microelectron. Eng. 21, 231 (1993).
5. M. Irmscher, R. Springer, and B. Höfflinger, Microelectron. Eng. 30, 301 (1996).
6. M. Irmscher, B. Hoefflinger, and R. Springer, J. Vac. Sci. Technol. B 12, 3925 (1994).
7. G. R. Powell, M. Puttok, K. Powell, A. Iacopi, D. Tossei, and C. Kuhl (unpublished).