Low-k dielectric costs for dual-damascene integration

Solid State Technology

Volumn 42, Issue 5, 1999, Pages 43-51

  Korczynski, Ed ^a  

^a Solid State Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0002025839     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (7)

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2. B. Zhao, et al., Materials Res. Soc. Symp. Proc., Vol. 427, pp. 415-426, 1996.
3. E. Korczynski, Materials Res. Soc. Symp. Proc., Vol. 476, pp. 177-182, 1997.
4. K.K.S. Lau, C.B. Labelle, K.K. Gleason, Proc. of Dielectrics for ULSI Multilevel Interconnection Conference, pp. 11-21, 1999.
5. M.K. Jain, et al., Proc. of VLSI Multilevel Interconnection Conference, pp. 23-27, 1996.
6. V. McGahay, et al., Proc. of VLSI Multilevel Interconnection Conference, pp. 116-118, 1996.
7. Y. Matsubara, et al., Technical Digest of International Electron Devices Meeting, p. 369, 1996.