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Volumn 87, Issue 12, 2000, Pages 8380-8384
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Investigation of the interaction between silicon interstitials and dislocation loops using the wafer bonding technique
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Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 0001406963
PISSN: 00218979
EISSN: None
Source Type: Journal
DOI: 10.1063/1.373550 Document Type: Article |
Times cited : (2)
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References (14)
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