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Volumn 3511, Issue , 1998, Pages 357-363

High aspect-ratio fine-line metallization

Author keywords

Fine line; High aspect ratio; Lift off; Metallization; Micromachining; Preimidized polyimide; Silicon oxynitride; SU 8

Indexed keywords

ASPECT RATIO; ETCHING; MASKS; METALLIZING; PHOTORESISTS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POLYIMIDES; SILICON WAFERS;

EID: 0001074665     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.324322     Document Type: Conference Paper
Times cited : (4)

References (10)
  • 1
    • 0020129925 scopus 로고
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    • May/June
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    • Grabbe, P.1    Hu, E.L.2    Howard, R.E.3
  • 2
    • 0020734887 scopus 로고
    • Lift-off process for achieving fine-line metalization
    • Apr/June
    • A.A. Milgram, "Lift-off process for achieving fine-line metalization," J. Vac. Sci. Technol., B1(2), Apr/June 1983, pp. 490-493.
    • (1983) J. Vac. Sci. Technol. , vol.B1 , Issue.2 , pp. 490-493
    • Milgram, A.A.1
  • 4
    • 0029509348 scopus 로고
    • Three-dimensional passive circuit technology for ultra-compact MMIC's
    • Dec.
    • Makoto Hirano, et al. "Three-Dimensional Passive Circuit Technology For Ultra-Compact MMIC's," IEEE MTT, Vol 43, No. 12. Dec. 1995, pp. 2845-2850.
    • (1995) IEEE MTT , vol.43 , Issue.12 , pp. 2845-2850
    • Hirano, M.1
  • 5
    • 0030421235 scopus 로고    scopus 로고
    • Folded U-shaped microwire technology for ultra-compact three-dimensional MMIC's
    • Dec.
    • Kiyomitsu Onodera, et al, "Folded U-Shaped Microwire Technology for Ultra-Compact Three-Dimensional MMIC's," IEEE MTT, Vol 44, No. 12, Dec. 1996, pp.2347-2353.
    • (1996) IEEE MTT , vol.44 , Issue.12 , pp. 2347-2353
    • Onodera, K.1
  • 6
    • 0029697845 scopus 로고    scopus 로고
    • Folded U-shaped microwire technology for ultra-compact three-dimensional MMIC's
    • Kiyomitsu Onodera, et al, "Folded U-Shaped Microwire Technology for Ultra-Compact Three-Dimensional MMIC's," 1996 IEEE MTT-S Digest, pp. 1153-1156.
    • 1996 IEEE MTT-S Digest , pp. 1153-1156
    • Onodera, K.1
  • 7
    • 0029534556 scopus 로고    scopus 로고
    • A new fabrication process of a planar coil using photosensitive polyimide and electroplating
    • Y. Watanabe, M. Edo, H. Nakazawa, E. Yonezawa, "A new Fabrication Process of a Planar Coil Using Photosensitive Polyimide and Electroplating," Transducer'95, pp.268-271.
    • Transducer'95 , pp. 268-271
    • Watanabe, Y.1    Edo, M.2    Nakazawa, H.3    Yonezawa, E.4
  • 8
    • 0027041290 scopus 로고    scopus 로고
    • Fabrication of high depth-width aspect ratio microstructures
    • G. Engelmann, O. Ehrmann, J. Simon, H. Reichl, "Fabrication of High Depth-Width Aspect Ratio Microstructures," MEMS'92, pp. 93-98.
    • MEMS'92 , pp. 93-98
    • Engelmann, G.1    Ehrmann, O.2    Simon, J.3    Reichl, H.4
  • 9
    • 0031221057 scopus 로고    scopus 로고
    • SU-8: A low-cost negative resist for MEMS
    • H. Lorenz, et al, "SU-8: a low-cost negative resist for MEMS," J. Micromech. Microeng. 7 (1997), pp. 121-124.
    • (1997) J. Micromech. Microeng. , vol.7 , pp. 121-124
    • Lorenz, H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.