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Volumn 89, Issue 2, 2001, Pages 1402-1404

Significant improvement of electrical and thermal properties of low dielectric constant plasma polymerized paraxylene thin films by postdeposition H2+He plasma treatment

(5) Quan, Yong Chun a Yeo, Sanghak a Shim, Cheonman a Yang, Jaeyoung a Jung, Donggeun a

a Sungkyunkwan University (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000855561 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.1335826 Document Type: Article

Times cited : (14)

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