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Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 37, Issue 3 SUPPL. B, 1998, Pages 1383-1390

Wafer bonding of InP to Si and its application to optical devices

(2) Wada, Hiroshi a Kamijoh, Takeshi a

a OKI ELECTRIC INDUSTRY CO (Japan)

Author keywords

Optoelectronic integrated circuits; Semiconductor lasers; Wafer bonding

Indexed keywords

EID: 0000508569 PISSN: 00214922 EISSN: None Source Type: Journal
DOI: 10.1143/jjap.37.1383 Document Type: Article

Times cited : (25)

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