Reliability in large area solder joint assemblies and effects of thermal expansion mismatch and die size

Advancing Microelectronics

Volumn 26, Issue 5, 1999, Pages 37-44

  He, Jun ^a   Morris, W L ^a   Shaw, M C ^a   Sridhar, N ^a  

^a ROCKWELL SCIENCE CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; FRACTURE; MATHEMATICAL MODELS; RAMAN SPECTROSCOPY; RELIABILITY; RESIDUAL STRESSES; SILICON; SOLDERING; SOLDERING ALLOYS; THERMAL EXPANSION; THERMAL STRESS;

RAMAN PIEZOSPECTROSCOPY;

ELECTRONICS PACKAGING;

EID: 0032669974     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)