Microstructural modelling and electronic interconnect reliability

Soldering and Surface Mount Technology

Volumn 9, Issue 2, 1997, Pages 61-64

  Winter, P R ^a   Wallach, E R ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTERMETALLICS; LEAD; MATHEMATICAL MODELS; MICROSTRUCTURE; RELIABILITY; SERVICE LIFE; STRAIN; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; TIN;

BALL GRID ARRAY; ELECTRONIC SURFACE MOUNT COMPONENT; STRAIN DISTRIBUTION; TIN RICH PHASE;

SOLDERED JOINTS;

EID: 0031188494     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540919710777536     Document Type: Article

References (17)

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