Diamond wire machining of wood

Forest Products Journal

Volumn 54, Issue 11, 2004, Pages 50-55

  Hardin, Craig W ^a   Shih, Albert J ^b   Lemaster, Richard L ^c  

^a North Carolina State University   (United States)

^b NORTH CAROLINA STATE UNIVERSITY   (United States)

^c UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIAMOND WIRES; SEMICONDUCTOR WAFERS; WIRE CUTTING; WIRE SAWING;

ABRASIVES; MACHINING; SINGLE CRYSTALS; THICKNESS MEASUREMENT; WIRE;

WOOD;

ABRASIVES; MACHINING; SINGLE CRYSTALS; THICKNESS; WIRE; WOOD;

PINUS STROBUS; QUERCUS; QUERCUS ALBA;

EID: 9944223836     PISSN: 00157473     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. Clark, W.I., A.J. Shih, R.L. Lemaster, and S.B. McSpadden. 2003a. Fixed abrasive diamond wire machining - part II: Experiment design and results. Inter. J. of Machine Tools and Manufacture 43:533-542.
2. _, _, C.W. Hardin, R.L. Lemaster, and S.B. McSpadden. 2003b. Fixed abrasive diamond wire machining - part I: Process monitoring and wire geometry and tension. Inter. J. of Machine Tools and Manufacture 43:523-532.
3. Hodsden, J. B. and J. B. Hodsden. 2000. Continuous wire saw loop and method of manufacture thereof. US Patent Number 6,065,462.
4. Hardin, C.W. 2003. Fixed-abrasive diamond wire saw slicing of single crystal SiC wafers and wood. M.S. Thesis. North Carolina State University, Raleigh, NC.
5. _, J. Qu, and A.J. Shih. 2004. Fixed abrasive diamond wire saw slicing of single crystal SiC wafers. Materials and Manufacturing Processes 19:355-367.