Analysis and validation of thermal and packaging effects of a piezoresistive pressure sensor

Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an

Volumn 27, Issue 7, 2004, Pages 955-964

  Peng, Chih Tang ^a   Lin, Ji Cheng ^a   Lin, Chun Te ^a   Chiang, Kuo Ning ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Finite element method (FEM); Package; Parametric analysis; Piezoresistive pressure sensor

Indexed keywords

COMPUTER SIMULATION; ELECTRIC POTENTIAL; FINITE ELEMENT METHOD; OPTIMIZATION; PARAMETRIC DEVICES; SENSITIVITY ANALYSIS; SENSORS; THERMAL EFFECTS;

PACKAGE; PARAMETRIC ANALYSIS; PIEZORESISTIVE PRESSURE SENSORS; SENSOR STRUCTURE;

PRESSURE EFFECTS;

EID: 9744242192     PISSN: 02533839     EISSN: 21587299     Source Type: Journal    
DOI: 10.1080/02533839.2004.9670950     Document Type: Article

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