Piezoresistive sensor chip for measurement of stress in electronic packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1993, Pages 686-692

  Jaeger, Richard C ^a   Suhling, Jeffrey C ^a   Carey, Martin T ^a   Johnson, R Wayne ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PIEZOELECTRIC TRANSDUCERS; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SENSORS; STRESS ANALYSIS; THERMAL EFFECTS;

PIEZORESISTIVE SENSOR CHIPS;

ELECTRONICS PACKAGING;

EID: 0027191792     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (23)