-
5
-
-
8844248319
-
-
Sensors Expo, Boston (USA)
-
M da Silva, R Giasolli, S Cunningham. and D DeRoo, "MEMS Design for Manufacturability (DFM)", Sensors Expo, Boston (USA), 2002
-
(2002)
MEMS Design for Manufacturability (DFM)
-
-
Da Silva, M.1
Giasolli, R.2
Cunningham, S.3
DeRoo, D.4
-
7
-
-
0002675963
-
Network-type modeling of micromachined sensor systems
-
Santa Clara (USA), April
-
G Lorenz and R Neul, "Network-Type Modeling of Micromachined Sensor Systems", Proc. Modeling and Simulation of Microsystems, Semiconductors, Sensors and Actuators, Santa Clara (USA), April 1998, pp. 233-238
-
(1998)
Proc. Modeling and Simulation of Microsystems, Semiconductors, Sensors and Actuators
, pp. 233-238
-
-
Lorenz, G.1
Neul, R.2
-
8
-
-
0034859112
-
A top-down design flow for MOEMS
-
SPIE, Cannes (France)
-
G Lorenz, A Morris and I Lakkis."A top-down design flow for MOEMS", Proc. Design, Test, Integration, and Pachaging of MEMS/MOEMS, SPIE, Cannes (France), 2001, pp.126-137
-
(2001)
Proc. Design, Test, Integration, and Pachaging of MEMS/MOEMS
, pp. 126-137
-
-
Lorenz, G.1
Morris, A.2
Lakkis, I.3
-
9
-
-
8844242928
-
VHDL-1076.1 modeling examples for microsystem simulation
-
Toledo (Spain). April
-
B Romanowicz, Y Ansel, M Laudon, Ch Amacker, P Renaud, A Vachoux and G Schröpfer, "VHDL-1076.1 modeling examples for microsystem simulation", 2nd workshop on libraries, component modeling and quality assurance, accompanying computer hardware description languages symposium, Toledo (Spain). April 1997
-
(1997)
2nd Workshop on Libraries, Component Modeling and Quality Assurance, Accompanying Computer Hardware Description Languages Symposium
-
-
Romanowicz, B.1
Ansel, Y.2
Laudon, M.3
Amacker, Ch.4
Renaud, P.5
Vachoux, A.6
Schröpfer, G.7
-
11
-
-
8844270612
-
Co-design of MEMS and electronics
-
Lódź, Poland, 26-28 June
-
G Schröpfer, J van Kuijk, G Lorenz, F-X Musalem, C Welham and M Dasilva, "Co-design of MEMS and Electronics", 10th International Conference of Mixed Design of Integrated Circuits and Systems. Lódź, Poland, 26-28 June 2003
-
(2003)
10th International Conference of Mixed Design of Integrated Circuits and Systems
-
-
Schröpfer, G.1
Van Kuijk, J.2
Lorenz, G.3
Musalem, F.-X.4
Welham, C.5
Dasilva, M.6
-
12
-
-
0035763547
-
Engineering in- and out-of-plane stress in PECVD silicon nitride for CMOS-compatible micromachining
-
SPIE-4557, San Francisco (USA). Oct.
-
R Davies. M McNie, K Brunson & D Combes, "Engineering in- and out-of-plane stress in PECVD silicon nitride for CMOS-compatible micromachining", SPIE-4557, Int. Symposium on 'Micromachining and Microfabrication', San Francisco (USA). Oct. 2001, pp.320-328
-
(2001)
Int. Symposium on 'Micromachining and Microfabrication'
, pp. 320-328
-
-
Davies, R.1
McNie, M.2
Brunson, K.3
Combes, D.4
-
13
-
-
2942685664
-
Control of stress in a metal-nitride-metal sandwich for CMOS-compatible surface micromachining
-
Paper A-8.5, Boston (USA), Dec
-
R R Davies, D J Combes, M E McNie & K M Brunson, "Control of Stress in a Metal-Nitride-Metal Sandwich for CMOS-Compatible Surface Micromachining", Paper A-8.5, Proc. MRS Fall Meeting, Boston (USA), Dec 2003
-
(2003)
Proc. MRS Fall Meeting
-
-
Davies, R.R.1
Combes, D.J.2
McNie, M.E.3
Brunson, K.M.4
-
14
-
-
8844264197
-
Metrology of materials for improved design in MEMS processes
-
Barcelona (Spain), Feb
-
ME McNie, R R Davies, D King, , K Brunson, L Koker, N Price, C Reeves, D Wallis, "Metrology of Materials for Improved Design in MEMS Processes", Proc. MEMSTAND workshop, Barcelona (Spain), Feb 2003
-
(2003)
Proc. MEMSTAND Workshop
-
-
McNie, M.E.1
Davies, R.R.2
King, D.3
Brunson, K.4
Koker, L.5
Price, N.6
Reeves, C.7
Wallis, D.8
-
15
-
-
8844250477
-
Metal-nitride surface micromachining
-
Revision 1.1, published QinetiQ Ltd and Coventor Sarl
-
INTEGRAM Metal-Nitride Prototyping Kit, Design Handbook, Metal-nitride surface micromachining. Revision 1.1, published 2003 by QinetiQ Ltd and Coventor Sarl
-
(2003)
INTEGRAM Metal-nitride Prototyping Kit, Design Handbook
-
-
-
16
-
-
0037998356
-
CMOS compatibility of high aspect ratio micromachining (HARM) in bonded silicon-on-insulator (BSOI)
-
SPIE-3511, San Jose (USA), Sept.
-
M E McNie & D O King, "CMOS compatibility of High Aspect Ratio Micromachining (HARM) in bonded Silicon-on-Insulator (BSOI)", SPIE-3511, Int. Symposium on 'Micromachining and Microfabrication', San Jose (USA), Sept. 1998, pp.277-287
-
(1998)
Int. Symposium on 'Micromachining and Microfabrication'
, pp. 277-287
-
-
McNie, M.E.1
King, D.O.2
-
17
-
-
0041787806
-
High aspect ratio micromachining (HARM) technologies for microinertial devices
-
M E McNie, D O King, C A Vizard, A S Holmes & K W Lee, "High aspect ratio micromachining (HARM) technologies for microinertial devices", Journal of Microsystems Technologies, Vol. 6, pp. 184-188, 2000
-
(2000)
Journal of Microsystems Technologies
, vol.6
, pp. 184-188
-
-
McNie, M.E.1
King, D.O.2
Vizard, C.A.3
Holmes, A.S.4
Lee, K.W.5
-
18
-
-
0034856893
-
Characterisation and optimisation of deep dry etching for MEMS applications
-
SPIE-4407, Edinburgh (UK), May
-
A L Rickard & M E McNie, "Characterisation and optimisation of deep dry etching for MEMS applications", SPIE-4407, International Conference on "Microelectronic and MEMS Technologies", Edinburgh (UK), May 2001, pp.78-88
-
(2001)
International Conference on "Microelectronic and MEMS Technologies"
, pp. 78-88
-
-
Rickard, A.L.1
McNie, M.E.2
-
19
-
-
8844251208
-
SOI micromachining
-
Revision 2.0b, published by QinetiQ Ltd and Coventor Sarl
-
INTEGRAM Deep Prototyping Kit, Design Handbook, SOI Micromachining, Revision 2.0b, published by QinetiQ Ltd and Coventor Sarl
-
INTEGRAM Deep Prototyping Kit, Design Handbook
-
-
-
20
-
-
8844270613
-
-
US patent 6,542,829, assigned to Coventor Inc.
-
US patent 6,542,829, assigned to Coventor Inc.
-
-
-
-
21
-
-
0034270152
-
Electronically probed measurements of MEMS geometries
-
Sept.
-
Gupta Raj K., "Electronically Probed Measurements of MEMS Geometries", J. MEMS., Vol. 9, No. 3, Sept. 2000, p.380
-
(2000)
J. MEMS
, vol.9
, Issue.3
, pp. 380
-
-
Gupta Raj, K.1
|