Influence of Cu(100) substrate on growth, morphology, structural and magnetic properties of high coercivity electrodeposited Co-Pt-P thin films

Journal of the Electrochemical Society

Volumn 151, Issue 10, 2004, Pages

  Zana, Iulica ^a,b   Zangari, Giovanni ^b,d   Shamsuzzoha, Mohamad ^a,c  

^a University of Alabama   (United States)

^b University of Alabama   (United States)

^c UNIVERSITY OF ALABAMA   (United States)

^d University of Virginia   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COBALT; COERCIVE FORCE; CRYSTALLINE MATERIALS; CURRENT DENSITY; ELECTROCHEMISTRY; ELECTRODEPOSITION; GRAIN BOUNDARIES; MAGNETIZATION; PHOSPHORUS; PLATINUM; SOLUTIONS; SURFACE PHENOMENA; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

ALLOY MICROSTRUCTURES; DEPTH PROFILING METHOD; GROWTH MORPHOLOGY; X-RAY DIFFRACTOMETERS;

COPPER;

EID: 8744287514     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1793911     Document Type: Article

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