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Volumn 4, Issue , 2004, Pages 2960-2966

IGBT operation at cryogenic temperatures: Non-punch-through and punch-through comparison

Author keywords

IGBT NPT PT Cryogenic

Indexed keywords

CONDUCTION DROPS; DEVICE UNDER TEST (DUT); NON PUNCH THROUGH (NPT); PUNCH THROUGH (PT);

EID: 8744284440     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PESC.2004.1355305     Document Type: Conference Paper
Times cited : (22)

References (10)
  • 6
    • 0016091407 scopus 로고
    • Semiconductor devices suitable for use in cryogenic environments
    • Aug.
    • B. Lengler, "Semiconductor devices suitable for use in cryogenic environments" Cryogenics, Vol. 14, n. 8, Aug. 1974, pp 439-447
    • (1974) Cryogenics , vol.14 , Issue.8 , pp. 439-447
    • Lengler, B.1
  • 8
    • 4243123743 scopus 로고
    • Behavior of IGBT modules in the temperature range from 5 to 300K
    • Columbus, OH July
    • F. Rosenbauer, H.W. Lorenzen, "Behavior of IGBT modules in the temperature range from 5 to 300K", Cryogenics engineering conference, Columbus, OH July 1995
    • (1995) Cryogenics Engineering Conference
    • Rosenbauer, F.1    Lorenzen, H.W.2
  • 10
    • 0036088167 scopus 로고    scopus 로고
    • Application of distributed superconducting magnetic energy storage system (D-SMES) in the entergy system to improve voltage stability
    • IEEE, 27-31 Jan. vol.2
    • S. Kolluri, "Application of distributed superconducting magnetic energy storage system (D-SMES) in the entergy system to improve voltage stability", Power Engineering Society Winter Meeting, 2002. IEEE, Volume: 2, 27-31 Jan. 2002 Page(s): 838-841 vol.2
    • (2002) Power Engineering Society Winter Meeting, 2000 , vol.2 , pp. 838-841
    • Kolluri, S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.