Measurements of mechanical properties of thin polymer films by nanoindentation technique

Key Engineering Materials

Volumn 270-273, Issue II, 2004, Pages 1107-1112

  Hur, Shin ^a   Hong, Sung In ^b   Lee, Hak Joo ^a   Han, Seung Woo ^a   Kim, Jae Hyun ^a   Kang, Jae Youn ^a   Choi, Byung Ik ^a   Oh, Chung Seog ^c  

^a Korea Institute of Machine and Materials   (South Korea)

^b Chungnam National University   (South Korea)

^c Kumoh National Institute of Technology   (South Korea)

Author keywords

Creep test; Nanoindentation; Polymer films; Viscoelastic property

Indexed keywords

ATOMIC FORCE MICROSCOPY; CREEP TESTING; DATA REDUCTION; ELASTIC MODULI; HARDNESS; LITHOGRAPHY; NANOTECHNOLOGY; SILICON WAFERS; SUBSTRATES; THERMOSETS; VISCOELASTICITY;

MICRORESISTS; NANOIMPRINTING; NANOINDENTATION; POLYMER FILMS;

PLASTIC FILMS;

EID: 8644224920     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

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