Nanoindentation analysis of viscoelastic thin films: Strain rate and adhesion effects

Materials Research Society Symposium - Proceedings

Volumn 695, Issue , 2002, Pages 121-126

  Palacio, Manuel Luis B ^a   Scherban, Tracey ^b   Sun, Brad ^b   Xu, Jessica ^b   Gerberich, William W ^a  

^a University of Minnesota   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CREEP TESTING; DIELECTRIC MATERIALS; ELASTIC MODULI; MATHEMATICAL MODELS; MECHANICAL VARIABLES MEASUREMENT; NANOSTRUCTURED MATERIALS; NUMERICAL METHODS; PERMITTIVITY; POLYIMIDES; STRAIN RATE; VISCOELASTICITY;

ADHESION EFFECTS; INTERLAYER DIELECTRIC; NANOINDENTIATION CREEP TESTS; POLYMER DIELECTRIC; THREE ELEMENT STANDARD LINEAR SOLID MODEL; VISCOELASTIC THIN FILMS;

THIN FILMS;

EID: 0036350004     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. Organic dielectrics in multilevel metallization of integrated circuits
2. Polyimides