MEMS parameter identification on wafer level using laser doppler vibrometer

Smart Systems Integration 2007 - European Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, MOEMS, ICs and Electronic Components, SSI 2007

Volumn , Issue , 2007, Pages

  Michael, Steffen ^a   Kurth, Steffen ^b   Klattenhoff, Jens ^c   Hering, Siegfried ^d   Werner, Frank Michael ^e  

^a Development Department   (Germany)

^b FRAUNHOFER IZM   (Germany)

^c POLYTEC GMBH   (Germany)

^d X FAB Semiconductor Foundries AG   (Germany)

^e SUSS MicroTec Testsystems GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 85051581658     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. th Annual International Reliability Physics Symposium, Orlando, FL, USA, 2001, pp.99-105
2. Tanner, D.M. et al: “Resonant frequency method for monitoring MEMS fabrication”, Reliability, Testing and Characterization of MEMS/MOEMS II, San Jose, CA, USA, 2003, pp. 220-228
3. Rembe, C. et al, “Accurate New 3D-Motion Analyzer for MEMS”, Microsystem Technologies 2003, Editor H.Reichl, Franzis Verlag, 2003, pp. 435-442