Reliability characterization of the SLICC package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 1202-1210

  Lall, Pradeep ^a   Gold, Glenn ^a   Miles, Barry ^a   Banerji, Kingshuk ^a   Thompson, Pat ^a   Koehler, Corey ^a   Adhihetty, Indira ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; EPOXY RESINS; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY;

BALL GRID ARRAY PACKAGE; DIRECT CHIP ATTACH TECHNOLOGY; ENCAPSULANT; INTERPOSER SUBSTRATE; PLATED THROUGH HOLES; SLIGHTLY LARGER THAN IC CARRIER; SOLDER BUMPS;

ELECTRONICS PACKAGING;

EID: 0029696534     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)