Antimony telluride thin films electrodeposited in an alkaline electrolyte

Journal of Electronic Materials

Volumn 40, Issue 7, 2011, Pages 1506-1511

  Qiu, W J ^a   Yang, S H ^a   Zhu, T J ^a   Xie, J ^a   Zhao, X B ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

Alkaline electrolyte; Antimony telluride; Electrochemical deposition; Thermoelectric materials; Thin films

Indexed keywords

AMORPHOUS FILMS; CRYSTAL STRUCTURE; DEAERATION; DEGASSING; DEPOSITION; ELECTRODEPOSITION; ELECTROLYTES; FILMS; POLYMER FILMS; REDUCTION; SEEBECK COEFFICIENT; TELLURIUM COMPOUNDS; THERMODYNAMICS; THERMOELECTRICITY;

ALKALINE ELECTROLYTES; ANTIMONY TELLURIDE; ELECTRICAL RESISTANCES; ELECTROCHEMICAL DEPOSITION; HOT UNIAXIAL PRESSING; OXYGEN CONTAMINATION; OXYGEN INTERFERENCE; THERMO-ELECTRIC MATERIALS;

THIN FILMS;

EID: 85027949605     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-011-1647-4     Document Type: Article

References (24)

1. L.D. Hicks and M.D. Dresselhaus, Phys. Rev. B 47, 12727 (1993).
2. R. Venkatasubramanian, E. Siivola, T. Colpitts, and B. O'Quinn, Nature 413, 597 (2001).
3. T.C. Harman, P.J. Taylor, M.P. Walsh, and B.E. Laforge, Science 297, 2229 (2002).
4. X.B. Zhao, X.H. Ji, H.Y. Zhang, T.J. Zhu, J.P. Tu, and X.B. Zhang, Appl. Phys. Lett. 86, 062111 (2005).
5. B. Poudel, Q. Hao, Y. Ma, Y.C. Lan, A. Minnich, B. Yu, X. Yan, D.Z. Wang, A. Muto, D. Vashaee, X.Y. Chen, J.M. Liu, M.S. Dresselhaus, G. Chen, and Z.F. Ren, Science 320, 634 (2008).
6. X.B. Zhao, T. Sun, T.J. Zhu, and J.P. Tu, J. Mater. Chem. 15, 1621 (2005).
7. Y.Q. Cao, X.B. Zhao, T.J. Zhu, X.B. Zhang, and J.P. Tu, Appl. Phys. Lett. 92, 143106 (2008).
8. N.P. Osipovich, E.A. Streltsov, and A.S. Susha, Electrochem. Commun. 2, 822 (2000).
9. K. Tittes, A. Bund, W. Plieth, A. Bentien, S. Paschen, M. Plötner, H. Graäfe, and W.J. Fischer, J. Solid State Electrochem. 7, 714 (2003).
10. Y. Miyazaki and T. Kajitani, J. Cryst. Growth 229, 542 (2001).
11. J.P. Fleurial, A. Borshcheevsky, M.A. Ryan, W.M. Philips, G.J. Snyder, and T. Caillat, Mater. Res. Soc. Symp. Proc. 545, 493 (1998).
12. S. Michel, S. Diliberto, C. Boulanger, and B. Bolle, J. Cryst. Growth 196, 227 (2006).
13. B.W. Gregory and J.L. Stickney, J. Electroanal. Chem. 300, 543 (1991).
14. J.Y. Yang, W. Zhu, X.H. Gao, S.Q. Bao, and X.J. Fan, J. Electroanal. Chem. 577, 117 (2005).
15. K. Tittes and W. Plieth, J. Solid State Electrochem. 11, 155 (2007).
16. T. Hiramoto, S. Sugiyama, Y. Ishimori, and A. Fuwa, J. Jpn. Inst. Met. 72, 745 (2008).
17. F. Xiao, C. Hangarter, B.Y. Yoo, Y.W. Rheem, K.H. Lee, and N.V. Myung, Electrochim. Acta 53, 8103 (2008).
18. W.J. Qiu, S.N. Zhang, T.J. Zhu, and X.B. Zhao, Int. J.Miner. Metall. Mater. 17, 489 (2010).
19. M.S. Martin-Gonzalez, A.L. Prieto, R. Gronsky, T. Sands, and A.M. Stacy, J. Electrochem. Soc. 149, C546 (2002).
20. F.H. Li, Q.H. Huang, and W. Wang, Electrochim. Acta 54,3745 (2009).
21. S.K. Lim, M.Y. Kim, and T.S. Oh, Thin Solid Films 517, 4199 (2009).
22. G.J. Snyder, J.R. Lim, C.K. Huang, and J.P. Fleurial, Nat. Mater. 2, 528 (2003).
23. B.Y. Yoo, C.K. Huang, J.R. Lim, J. Herman, M.A. Ryan, J.P. Fleurial, and N.V. Myung, Electrochim. Acta 50, 4371 (2005).
24. K. Rothe, M. Stordeur, F. Heyroth, F. Syrowatka, and H.S. Leipner, J. Electron. Mater. 39, 1408 (2010).