SCOPUS 정보 검색 플랫폼

Volumn 9, Issue 22, 2017, Pages 7565-7569

Porous copper-graphene heterostructures for cooling of electronic devices

(8) Rho, Hokyun a,b Jang, Yea Sol b Kim, Sungmin c Bae, Sukang a Kim, Tae Wook a,d Lee, Dong Su a,d Ha, Jun Seok b Lee, Sang Hyun a

a Korea Institute of Science and Technology (South Korea)

b Chonnam National University (South Korea)

c Seoul National University (South Korea)

d University of Science and Technology (UST) (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRON DEVICES; ELECTRONIC COOLING; GRAPHENE; GRAPHENE DEVICES; HEAT RESISTANCE; HETEROJUNCTIONS; LUMINANCE; OPTOELECTRONIC DEVICES; THERMAL CONDUCTIVITY;

COOLING OF ELECTRONIC DEVICES; DEVICE MATERIALS; EXISTING PROBLEMS; HEAT DISSIPATION PROPERTIES; HIGH THERMAL CONDUCTIVITY; LARGE SURFACE AREA; REDUCED GRAPHENE OXIDES; THERMAL-ANNEALING;

LIGHT EMITTING DIODES;

EID: 85021794994 PISSN: 20403364 EISSN: 20403372 Source Type: Journal
DOI: 10.1039/c7nr01869j Document Type: Article

Times cited : (22)

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