High Dielectric Performances of Flexible and Transparent Cellulose Hybrid Films Controlled by Multidimensional Metal Nanostructures

Advanced Materials

Volumn 29, Issue 24, 2017, Pages

  Ji, Sangyoon ^a   Jang, Jiuk ^a   Cho, Eunjin ^a   Kim, Si Hoon ^a   Kang, Eun Seok ^b   Kim, Jihoon ^c   Kim, Han Ki ^d   Kong, Hoyoul ^e   Kim, Sun Kyung ^d   Kim, Ju Young ^a   Park, Jang Ung ^a  

^a Ulsan National Institute of Science and Technology   (South Korea)

^b LG Electronics Inc   (South Korea)

^c Kongju National University   (South Korea)

^d Kyung Hee University   (South Korea)

^e Korea Research Institute of Chemical Technology   (South Korea)

Author keywords

cellulose; high dielectric constants; metal nanofibers; touchscreen panels; transparent films

Indexed keywords

ASPECT RATIO; CELLULOSE; CELLULOSE FILMS; DIELECTRIC PROPERTIES; ELASTIC MODULI; ELECTRONIC EQUIPMENT; FILLERS; NANOFIBERS; NANOSTRUCTURES; TENSILE STRENGTH; THERMAL EXPANSION; THERMODYNAMIC STABILITY; THERMOELECTRIC EQUIPMENT; WEARABLE TECHNOLOGY;

DIELECTRIC CONSTANTS (K); HIGH DIELECTRIC CONSTANTS; OPTICAL AND DIELECTRIC PROPERTIES; PORTABLE ELECTRONIC DEVICES; TOUCH-SCREEN PANELS; TRANSPARENT FILMS; TRANSPARENT PLASTICS; UNCONVENTIONAL APPROACHES;

HIGH-K DIELECTRIC;

CELLULOSE FILM; DIELECTRIC PROPERTIES; ELECTRONICS; THERMAL STABILITY;

EID: 85018329736     PISSN: 09359648     EISSN: 15214095     Source Type: Journal    
DOI: 10.1002/adma.201700538     Document Type: Article

References (47)

1. J. A. Rogers, Z. Bao, K. Baldwin, A. Dodabalapur, B. Crone, V. R. Raju, V. Kuck, H. Katz, K. Amundson, J. Ewing, P. Drzaic, Proc. Natl. Acad. Sci. USA 2001, 98, 4835.
2. J. Wang, C. Yan, G. Cai, M. Cui, A. Lee-Sie Eh, P. See Lee, Adv. Mater. 2016, 28, 4490.
3. L. Peng, X. Peng, B. Liu, C. Wu, Y. Xie, G. Yu, Nano Lett. 2013, 13, 2151.
4. Y. J. Park, S.-K. Lee, M.-S. Kim, H. Kim, J.-H. Ahn, ACS Nano 2014, 8, 7655.
5. J. Kim, M.-S. Lee, S. Jeon, M. Kim, S. Kim, K. Kim, F. Bien, S. Y. Hong, J.-U. Park, Adv. Mater. 2015, 27, 3292.
6. K. Kim, J. Kim, B. G. Hyun, S. Ji, S.-Y. Kim, S. Kim, B. W. An, J.-U. Park, Nanoscale 2015, 7, 14577.
7. M.-S. Lee, K. Lee, S.-Y. Kim, H. Lee, J. Park, K.-H. Choi, H.-K. Kim, D.-G. Kim, D.-Y. Lee, S. Nam, J.-U. Park, Nano Lett. 2013, 13, 2814.
8. H. E. Lee, S. Kim, J. Ko, H.-I. Yeom, C.-W. Byun, S. H. Lee, D. J. Joe, T.-H. Im, S.-H. K. Park, K. J. Lee, Adv. Funct. Mater. 2016, 26, 6170.
9. S.-C. Chen, Y.-J. Chen, W. T. Chen, Y.-T. Yen, T. S. Kao, T.-Y. Chuang, Y.-K. Liao, K.-H. Wu, A. Yabushita, T.-P. Hsieh, M. D. B. Charlton, D. P. Tsai, H.-C. Kuo, Y.-L. Chueh, ACS Nano 2014, 8, 9341.
10. R. Matsuzaki, A. Todoroki, Sensors 2008, 8, 8123.
11. S. Bae, H. Kim, Y. Lee, X. Xu, J.-S. Park, Y. Zheng, J. Balakrishnan, T. Lei, H. Ri Kim, Y. I. Song, Y.-J. Kim, K. S. Kim, B. Özyilmaz, J.-H. Ahn, B. H. Hong, S. Iijima, Nat. Nanotechnol. 2010, 5, 574.
12. S. Y. Han, D. C. Kim, B. Cho, K. S. Jeon, S. M. Seo, M. S. Seo, S.-W. Jung, K. Jeong, W. K. Kim, S.-H. Yang, N.-H. Kim, J. Song, H.-S. Kong, H. G. Kim, J. Soc. Inf. Disp. 2011, 19, 855.
13. R. Adler, P. J. Desmares, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 1987, 34, 195.
14. S. Hotelling, J. A. Strickon, B. Q. Huppi, U.S. Patent 7,663,607, 2010.
15. S. P. Hotelling, B. R. Land, U.S. Patent 7,920,129, 2011.
16. S. Kim, W. Choi, W. Rim, Y. Chun, H. Shim, H. Kwon, J. Kim, I. Kee, S. Kim, S. Lee, J. Park, IEEE Trans. Electron Devices 2011, 58, 3609.
17. T. H. Hwang, W. H. Cui, I. S. Yang, O. K. Kwon, IEEE Trans. Consum. Electron. 2010, 56, 1115.
18. G. Walker, J. Soc. Inf. Disp. 2012, 20, 413.
19. G. Barrett, R. Omote, Inf. Disp. 2010, 26, 16.
20. H. Gu, C. Sterzik, Capacitive Touch Hardware Design Guide, M9SP430 Texas Instruments TX, USA 2013.
21. T. Inui, H. Koga, M. Nogi, N. Komoda, K. Suganuma, Adv. Mater. 2015, 27, 1112.
22. L. Qi, B. I. Lee, S. Chen, W. D. Samuels, G. J. Exarhos, Adv. Mater. 2005, 17, 1777.
23. L. Wang, Z.-M. Dang, Appl. Phys. Lett. 2005, 87, 42903.
24. F. He, S. Lau, H. L. Chan, J. Fan, Adv. Mater. 2009, 21, 710.
25. P. Kim, S. C. Jones, P. J. Hotchkiss, J. N. Haddock, B. Kippelen, S. R. Marder, J. W. Perry, Adv. Mater. 2007, 19, 1001.
26. W. Yang, R. Yi, X. Yang, M. Xu, S. Hui, X. Cao, Trans. Electr. Electron. Mater. 2012, 13, 116.
27. K. Ishimoto, E. Kanegae, Y. Ohki, T. Tanaka, Y. Sekiguchi, Y. Murata, C. C. Reddy, IEEE Trans. Dielectr. Electr. Insul. 2009, 16, 1735.
28. Z.-M. Dang, Y.-H. Lin, C.-W. Nan, Adv. Mater. 2003, 15, 1625.
29. J.-Y. Kim, J. Lee, W. H. Lee, I. N. Kholmanov, J. W. Suk, T. Kim, Y. Hao, H. Chou, D. Akinwande, R. S. Ruoff, ACS Nano 2014, 8, 269.
30. D. Klemm, B. Heublein, H.-P. Fink, A. Bohn, Angew. Chem., Int. Ed. 2005, 44, 3358.
31. J. Pérez, J. Muñoz-Dorado, T. de la Rubia, J. Martínez, Int. Microbiol. Off. J. Span. Soc. Microbiol. 2002, 5, 53.
32. Y. Okahisa, A. Yoshida, S. Miyaguchi, H. Yano, Compos. Sci. Technol. 2009, 69, 1958.
33. Z. Fang, H. Zhu, C. Preston, X. Han, Y. Li, S. Lee, X. Chai, G. Chen, L. Hu, J. Mater. Chem. C 2013, 1, 6191.
34. W. Kang, C. Yan, C. Y. Foo, P. S. Lee, Adv. Funct. Mater. 2015, 25, 4203.
35. Y. H. Jung, T.-H. Chang, H. Zhang, C. Yao, Q. Zheng, V. W. Yang, H. Mi, M. Kim, S. J. Cho, D.-W. Park, H. Jiang, J. Lee, Y. Qiu, W. Zhou, Z. Cai, S. Gong, Z. Ma, Nat. Commun. 2015, 6, 7170.
36. S. Ji, B. G. Hyun, K. Kim, S. Y. Lee, S.-H. Kim, J.-Y. Kim, M. H. Song, J.-U. Park, NPG Asia Mater. 2016, 8, e299.
37. P. Katta, M. Alessandro, R. D. Ramsier, G. G. Chase, Nano Lett. 2004, 4, 2215.
38. M. A. Meyers, K. K. Chawla, Mechanical Behavior of Materials, Cambridge University Press, Cambridge, UK 2009.
39. T. L. Anderson, T. L. Anderson, Fracture Mechanics: Fundamentals and Applications, CRC Press, Boca Raton, FL, USA 2005.
40. S.-K. Kim, X. Zhang, D. J. Hill, K.-D. Song, J.-S. Park, H.-G. Park, J. F. Cahoon, Nano Lett. 2015, 15, 753.
41. G. Brönstrup, N. Jahr, C. Leiterer, A. Csáki, W. Fritzsche, S. Christiansen, ACS Nano 2010, 4, 7113.
42. S. H. Xie, Y. Y. Liu, J. Y. Li, Appl. Phys. Lett. 2008, 92, 243121.
43. M.-C. Choi, Y. Kim, C.-S. Ha, Prog. Polym. Sci. 2008, 33, 581.
44. Y. Chen, Y. Mei, R. Kaltofen, J. I. Mönch, J. Schumann, J. Freudenberger, H.-J. Klauß, O. G. Schmidt, Adv. Mater. 2008, 20, 3224.
45. Y. J. Lin, C. C. Hsieh, C. H. Yu, C. H. Tung, D. C. H. Yu, in 2011 IEEE 61st Electron. Compon. Technol. Conf. ECTC, IEEE, New York 2011, pp. 634–638.
46. Application Note AN2869: Guidelines for Designing Touch Sensing Applications, STMicroelectronics, Geneva, Switzerland 2012, p. 43.
47. S. Ma, F. Ribeiro, K. Powell, J. Lutian, C. Møller, T. Large, J. Holbery, ACS Appl. Mater. Interfaces 2015, 7, 21628.