Aerosol-assisted low pressure plasma deposition of antimicrobial hybrid organic-inorganic Cu-composite thin films for food packaging applications

Innovative Food Science and Emerging Technologies

Volumn 41, Issue , 2017, Pages 130-134

  De Vietro, Nicoletta ^a   Conte, Amalia ^b   Incoronato, Anna Lucia ^b   Del Nobile, Matteo Alessandro ^b   Fracassi, Francesco ^a  

^a UNIVERSITY OF BARI   (Italy)

^b UNIVERSITY OF FOGGIA   (Italy)

Author keywords

Active packaging; Aerosol; Antibacterial Cu coatings; Low pressure plasma

Indexed keywords

AEROSOLS; BACTERIA; CELL CULTURE; CHARACTERIZATION; COMPOSITE FILMS; DEPOSITION; ELECTRIC DISCHARGES; INORGANIC COATINGS; ORGANIC-INORGANIC MATERIALS; PACKAGING; PACKAGING MACHINES; PACKAGING MATERIALS; POLYCARBONATES; SOLUTIONS; THIN FILMS;

ACTIVE PACKAGING; ACTIVE PACKAGING MATERIALS; ANTI-MICROBIAL PROPERTIES; CHEMICAL CHARACTERIZATION; CU COATINGS; LOW PRESSURE PLASMA; MICROBIAL CONCENTRATIONS; THREE ORDERS OF MAGNITUDE;

COPPER COMPOUNDS;

EID: 85014856217     PISSN: 14668564     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ifset.2017.02.010     Document Type: Article

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