Evaluation of Reliability of a Joint Using Anisotropic Conductive Adhesive

Journal of Japan Institute of Electronics Packaging

Volumn 6, Issue 2, 2003, Pages 153-160

  Kim, Won Keun ^a   Ikeda, Torn ^a   Miyazaki, Noriyuki ^a  

^a KYUSHU UNIVERSITY   (Japan)

Author keywords

Anisotropic Conductive Film (ACF); Delamination Test; Residual Stress; Stress Intensity Factor

Indexed keywords

EID: 85009589409     PISSN: 13439677     EISSN: 1884121x     Source Type: Journal    
DOI: 10.5104/jiep.6.153     Document Type: Article

References (5)

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