Miniaturized samples for bond strength and hermetic sealing evaluation for transmission laser joints

Journal of Laser Micro Nanoengineering

Volumn 3, Issue 3, 2007, Pages 186-195

  Newaz, Golam ^a,b   Sultana, Taslema ^a,b   Nusier, Saied ^a   Herfurth, Hans J ^c  

^a Wayne State University   (United States)

^b WAYNE STATE UNIVERSITY   (United States)

^c Fraunhofer Center for Laser Technology   (United States)

Author keywords

Bond strength; Hermeticity; Miniaturized sample; Near hermetic packaging; Transmission laser joint

Indexed keywords

EID: 85003824892     PISSN: None     EISSN: 18800688     Source Type: Journal    
DOI: 10.2961/jlmn.2008.03.0011     Document Type: Article

References (23)

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