From chip to cooling tower data center modeling: Influence of chip temperature control philosophy

Journal of Electronic Packaging, Transactions of the ASME

Volumn 133, Issue 3, 2011, Pages 31008-1-31008-6

  Walsh, Ed J ^a   Breen, Thomas J ^a   Punch, Jeff ^a   Shah, Amip J ^b   Bash, Cullen E ^b  

^a UNIVERSITY OF LIMERICK   (Ireland)

^b HEWLETT PACKARD LABORATORIES   (United States)

Author keywords

Chip to cooling tower; Data center cooling; Energy efficiency; Heat sink; Thermal management

Indexed keywords

EID: 84988429403     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4004657     Document Type: Article

References (13)

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