-
1
-
-
0346280209
-
Computational fluid dynamics modeling of high compute density data centers to assure system inlet air specifications
-
Presented at Kauai, HI
-
CD. Patel, C.E. Bash, C. Belady, L. Stahl, and D. Sullivan, "Computational fluid dynamics modeling of high compute density data centers to assure system inlet air specifications," Presented at Proc. IPACK'01 - The Pacific Rim/ASME International Electronics Packaging Technical Conference and Exhibition Kauai, HI, 2001.
-
(2001)
Proc. IPACK'01 - The Pacific Rim/ASME International Electronics Packaging Technical Conference and Exhibition
-
-
Patel, C.D.1
Bash, C.E.2
Belady, C.3
Stahl, L.4
Sullivan, D.5
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2
-
-
23944456350
-
-
California: Lawrence Berkeley National Laboratory and Rumsey Engineers, Inc
-
"Data Center Energy Benchmarking Case Study." California: Lawrence Berkeley National Laboratory and Rumsey Engineers, Inc., 2003.
-
(2003)
Data Center Energy Benchmarking Case Study
-
-
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3
-
-
23844482541
-
Investigation of indoor climate and power usage in a data center
-
J.F. Karlsson and B. Moshfegh, "Investigation of indoor climate and power usage in a data center," Energy and Buildings, vol. 37, pp. 1075-1083, 2005.
-
(2005)
Energy and Buildings
, vol.37
, pp. 1075-1083
-
-
Karlsson, J.F.1
Moshfegh, B.2
-
4
-
-
25844517505
-
Challenges of data center thermal management
-
R.R. Schmidt, E.E. Cruz, and M. Iyengar, "Challenges of data center thermal management," IBM Journal of Research and Development, vol. 49, pp. 709-723, 2005.
-
(2005)
IBM Journal of Research and Development
, vol.49
, pp. 709-723
-
-
Schmidt, R.R.1
Cruz, E.E.2
Iyengar, M.3
-
7
-
-
0033709714
-
A methodology for the design of perforated tiles in a raised floor data center using computational flow analysis
-
presented at, Las Vegas, NV
-
S. Kang, R.R. Schmidt, K.M. Kelkar, A. Radmehr, and S.V. Patankar, "A methodology for the design of perforated tiles in a raised floor data center using computational flow analysis," presented at ITHERM 2000 - Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, 2000.
-
(2000)
ITHERM 2000 - Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
-
-
Kang, S.1
Schmidt, R.R.2
Kelkar, K.M.3
Radmehr, A.4
Patankar, S.V.5
-
9
-
-
0037667701
-
Data center cooling
-
B.C. Koplin, "Data center cooling," ASHRAE Journal, vol. 45, pp. 46-53, 2003.
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(2003)
ASHRAE Journal
, vol.45
, pp. 46-53
-
-
Koplin, B.C.1
-
10
-
-
0001847603
-
Improving productivity in electronic packaging with flow network modeling (FNM)
-
C. Belady, K.M. Kelkar, and S.V. Patankar, "Improving productivity in electronic packaging with flow network modeling (FNM)," Electronics Cooling, vol. 5, pp. 36-40, 1995.
-
(1995)
Electronics Cooling
, vol.5
, pp. 36-40
-
-
Belady, C.1
Kelkar, K.M.2
Patankar, S.V.3
-
11
-
-
0346938385
-
Measurements and predictions of the flow distribution through perforated tiles in raised floor data centers
-
Presented at, Kauai, HI
-
R.R. Schmidt, K.C. Karki, K.M. Kelkar, A. Radmehr, and S.V. Patankar, "Measurements and predictions of the flow distribution through perforated tiles in raised floor data centers," Presented at IPACK'01 - The Pacific Rim / ASME International Electronics Packaging Technical Conference and Exhibition, Kauai, HI, 2001.
-
(2001)
IPACK'01 - The Pacific Rim / ASME International Electronics Packaging Technical Conference and Exhibition
-
-
Schmidt, R.R.1
Karki, K.C.2
Kelkar, K.M.3
Radmehr, A.4
Patankar, S.V.5
-
12
-
-
4444306665
-
Raised-floor data center: Perforated tile flow rates for various tile layouts
-
Presented at, Las Vegas, NV, USA
-
R.R. Schmidt, K.C. Karki, and S.V. Patankar, "Raised-floor data center: perforated tile flow rates for various tile layouts," Presented at ITHERM 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, USA, 2004.
-
(2004)
ITHERM 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
-
-
Schmidt, R.R.1
Karki, K.C.2
Patankar, S.V.3
-
14
-
-
32844459483
-
Distributed leakage flow in raised-floor data centers
-
Presented at, San Franciso, CA
-
A. Radmehr, R.R. Schmidt, K.C. Karki, and S.V. Patankar, "Distributed leakage flow in raised-floor data centers," Presented at IPACK'05 - International Electronic Packaging Technical Conference and Exhibition, San Franciso, CA, 2005.
-
(2005)
IPACK'05 - International Electronic Packaging Technical Conference and Exhibition
-
-
Radmehr, A.1
Schmidt, R.R.2
Karki, K.C.3
Patankar, S.V.4
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16
-
-
0037394012
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Use of computational fluid dynamics for calculating flow rates through perforated tiles in raised-floor data centers
-
Air-Conditioning and Refrigeration Research
-
K.C. Karki, A. Radmehr, and S.V. Patankar, "Use of computational fluid dynamics for calculating flow rates through perforated tiles in raised-floor data centers," International Journal of Heating, Ventilation, Air-Conditioning and Refrigeration Research, vol. 9, pp. 153-166, 2003.
-
(2003)
International Journal of Heating, Ventilation
, vol.9
, pp. 153-166
-
-
Karki, K.C.1
Radmehr, A.2
Patankar, S.V.3
-
17
-
-
34247602764
-
-
Innovative Research Inc., TileFlow v. 3.0: A Simulation Tool for Airflow and Temperature Distribution in Raised-Floor Data Centers. Plymouth, MN, 2006.
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Innovative Research Inc., TileFlow v. 3.0: A Simulation Tool for Airflow and Temperature Distribution in Raised-Floor Data Centers. Plymouth, MN, 2006.
-
-
-
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18
-
-
31344443579
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Airflow distribution through perforated tiles in raised-floor data centers
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K.C. Karki and S.V. Patankar, "Airflow distribution through perforated tiles in raised-floor data centers," Building and Environment, vol. 41, pp. 734-744, 2006.
-
(2006)
Building and Environment
, vol.41
, pp. 734-744
-
-
Karki, K.C.1
Patankar, S.V.2
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19
-
-
84950136782
-
Thermal considerations in cooling of large scale high compute density data centers
-
Presented at, San Diego, CA
-
C.D. Patel, R. Sharma, C.E. Bash, and A. Beitelmal, "Thermal considerations in cooling of large scale high compute density data centers," Presented at ITHERM 2002 - Eight Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, 2002.
-
(2002)
ITHERM 2002 - Eight Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
-
-
Patel, C.D.1
Sharma, R.2
Bash, C.E.3
Beitelmal, A.4
-
20
-
-
84897584609
-
Dimensionless parameters for the evaluation of thermal design and performance of large-scale data centers
-
R.K. Sharma, C.E. Bash, and C.D. Patel, "Dimensionless parameters for the evaluation of thermal design and performance of large-scale data centers," AIAA, vol. AIAA 2002-3091, 2002.
-
(2002)
AIAA
, vol.AIAA 2002-3091
-
-
Sharma, R.K.1
Bash, C.E.2
Patel, C.D.3
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24
-
-
1842482918
-
Cluster of high powered racks within a raised floor computer data center: Effects of perforated tiles flow distribution on rack inlet air temperature
-
Presented at, Washington D.C
-
R.R. Schmidt and E. Cruz, "Cluster of high powered racks within a raised floor computer data center: Effects of perforated tiles flow distribution on rack inlet air temperature," Presented at IMECE'03 - ASME International Mechanical Engineering Congress and R&D Exposition, Washington D.C, 2003.
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(2003)
IMECE'03 - ASME International Mechanical Engineering Congress and R&D Exposition
-
-
Schmidt, R.R.1
Cruz, E.2
-
25
-
-
13944283050
-
Cluster of high-powered racks within a raised-floor computer data center: Effect of perforated tile flow distribution on rack inlet air temperatures
-
R.R. Schmidt and E.E. Cruz, "Cluster of high-powered racks within a raised-floor computer data center: Effect of perforated tile flow distribution on rack inlet air temperatures," ASME Journal of Electronic Packaging, vol. 126, pp. 510-518, 2004.
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(2004)
ASME Journal of Electronic Packaging
, vol.126
, pp. 510-518
-
-
Schmidt, R.R.1
Cruz, E.E.2
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26
-
-
32844456619
-
Optimization of data center room layout to minimize rack inlet air temperature
-
Presented at, San Francisco, CA
-
S. Bhopte, D. Agonafer, R.R. Schmidt, and B. Sammakia, "Optimization of data center room layout to minimize rack inlet air temperature," Presented at IPACK'05 - International Electronic Packaging Technical Conference and Exhibition, San Francisco, CA, 2005.
-
(2005)
IPACK'05 - International Electronic Packaging Technical Conference and Exhibition
-
-
Bhopte, S.1
Agonafer, D.2
Schmidt, R.R.3
Sammakia, B.4
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28
-
-
32844464366
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Comparative analysis of different data center airflow management configurations
-
Presented at, San Francisco, CA
-
S. Shrivastava, B. Sammakia, R.R. Schmidt, and M. Iyengar, "Comparative analysis of different data center airflow management configurations," Presented at IPACK'05 - International Electronic Packaging Technical Conference and Exhibition, San Francisco, CA, 2005.
-
(2005)
IPACK'05 - International Electronic Packaging Technical Conference and Exhibition
-
-
Shrivastava, S.1
Sammakia, B.2
Schmidt, R.R.3
Iyengar, M.4
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29
-
-
32844472688
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Thermal characterization of non-raised floor air cooled data centers using numerical modeling
-
Presented at, San Francisco, CA
-
M. Iyengar, R.R. Schmidt, A. Sharma, G. McVicker, S. Shrivastava, S. Sri-Jayantha, Y. Amemiya, H. Dang, T. Chainer, and B. Sammakia, "Thermal characterization of non-raised floor air cooled data centers using numerical modeling," Presented at IPACK'05 - International Electronic Packaging Technical Conference and Exhibition, San Francisco, CA, 2005.
-
(2005)
IPACK'05 - International Electronic Packaging Technical Conference and Exhibition
-
-
Iyengar, M.1
Schmidt, R.R.2
Sharma, A.3
McVicker, G.4
Shrivastava, S.5
Sri-Jayantha, S.6
Amemiya, Y.7
Dang, H.8
Chainer, T.9
Sammakia, B.10
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32
-
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84889617716
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Thermal modeling of technology infrastructure facilities: A Case Study of Data Centers
-
in The, W.J. Minkowycz, E.M. Sparrow, and J.Y. Murthy, Eds. New York: Taylor and Francis
-
J. Rambo and Y. Joshi, "Thermal modeling of technology infrastructure facilities: A Case Study of Data Centers," in The Handbook of Numerical Heat Transfer: Vol II, W.J. Minkowycz, E.M. Sparrow, and J.Y. Murthy, Eds. New York: Taylor and Francis, 2006, pp. 821-849.
-
(2006)
Handbook of Numerical Heat Transfer
, vol.2
, pp. 821-849
-
-
Rambo, J.1
Joshi, Y.2
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33
-
-
4444358793
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Experimental investigation of design and performance of data centers
-
Presented at, Las Vegas, NV
-
R. Sharma, C.E. Bash, CD. Patel, and M. Beitelmal, "Experimental investigation of design and performance of data centers," Presented at ITHERM 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, 2004.
-
(2004)
ITHERM 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
-
-
Sharma, R.1
Bash, C.E.2
Patel, C.D.3
Beitelmal, M.4
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34
-
-
1542270208
-
Research on efficiency of air conditioning system for data center
-
Presented at, Yokohama, Japan
-
M. Norota, H. Hayama, M. Enai, T. Mori, and M. Kishita, "Research on efficiency of air conditioning system for data center," Presented at INTELEC'03 - 25th International Telecommunications Energy Conference, Yokohama, Japan, 2003.
-
(2003)
INTELEC'03 - 25th International Telecommunications Energy Conference
-
-
Norota, M.1
Hayama, H.2
Enai, M.3
Mori, T.4
Kishita, M.5
-
35
-
-
1842583748
-
Exergy analysis of data center thermal management systems
-
Presented at, Washington, D.C
-
A. Shah, V.P. Carey, C.E. Bash, and C.D. Patel, "Exergy analysis of data center thermal management systems," Presented at IMECE'03 - ASME International Mechanical Engineering Congress and R&D Exposition, Washington, D.C, 2003.
-
(2003)
IMECE'03 - ASME International Mechanical Engineering Congress and R&D Exposition
-
-
Shah, A.1
Carey, V.P.2
Bash, C.E.3
Patel, C.D.4
-
36
-
-
32844466042
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Exergy-based optimization strategies for multicomponent data center thermal management: Part I: Analysis
-
presented at, San Francisco, CA
-
A..T. Shah, V.P. Carey, C.E. Bash, and C.D. Patel, "Exergy-based optimization strategies for multicomponent data center thermal management: Part I: Analysis," presented at IPACK'05 - International Electronic Packaging Technical Conference and Exhibition, San Francisco, CA, 2005.
-
(2005)
IPACK'05 - International Electronic Packaging Technical Conference and Exhibition
-
-
Shah, A.T.1
Carey, V.P.2
Bash, C.E.3
Patel, C.D.4
-
37
-
-
32844460498
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Exergy-based optimization strategies for multi-component data center thermal management: Part II: Application and validation
-
Presented at, San Francisco, CA
-
A.J. Shah, V.P. Carey, C.E. Bash, and C.D. Patel, "Exergy-based optimization strategies for multi-component data center thermal management: Part II: Application and validation," Presented at IPACK'05 - International Electronic Packaging Technical Conference and Exhibition, San Francisco, CA, 2005.
-
(2005)
IPACK'05 - International Electronic Packaging Technical Conference and Exhibition
-
-
Shah, A.J.1
Carey, V.P.2
Bash, C.E.3
Patel, C.D.4
-
38
-
-
29544435716
-
Thermal performance metrics for arranging forced air cooled servers in a data processing cabinet
-
J. Rambo and Y. Joshi, "Thermal performance metrics for arranging forced air cooled servers in a data processing cabinet," ASME Journal of Electronic Packaging, vol. 127, pp. 452-459, 2005.
-
(2005)
ASME Journal of Electronic Packaging
, vol.127
, pp. 452-459
-
-
Rambo, J.1
Joshi, Y.2
-
39
-
-
29144450886
-
Rack cooling effectiveness in data centers and telecom central offices: The rack cooling index (RCI)
-
M.K. Herrlin, "Rack cooling effectiveness in data centers and telecom central offices: The rack cooling index (RCI)," ASHRAE Transactions, vol. 111, pp. 725-731, 2005.
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(2005)
ASHRAE Transactions
, vol.111
, pp. 725-731
-
-
Herrlin, M.K.1
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41
-
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29644445874
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Towards sustainable design of data centers: Addressing the lifecycle mismatch problem
-
Presented at, San Franciso, CA
-
N. Rolander, J. Rambo, Y. Joshi, and F. Mistree, "Towards sustainable design of data centers: Addressing the lifecycle mismatch problem," Presented at IPACK'05 - International Electronic Packaging Technical Conference and Exhibition, San Franciso, CA, 2005.
-
(2005)
IPACK'05 - International Electronic Packaging Technical Conference and Exhibition
-
-
Rolander, N.1
Rambo, J.2
Joshi, Y.3
Mistree, F.4
-
42
-
-
34247628652
-
Robust design of turbulent convective systems using the proper orthogonal decomposition
-
accepted for publication
-
N. Rolander, J. Rambo, Y. Joshi, F. Mistree, and J.K. Allen, "Robust design of turbulent convective systems using the proper orthogonal decomposition," ASME Journal of Mechanical Design: Special Issue Robust and Risk Based Design, accepted for publication 2006.
-
(2006)
ASME Journal of Mechanical Design: Special Issue Robust and Risk Based Design
-
-
Rolander, N.1
Rambo, J.2
Joshi, Y.3
Mistree, F.4
Allen, J.K.5
-
43
-
-
33845546978
-
Reduced-order modeling of multiscale turbulent convection: Application to data center thermal management,
-
Ph.D. Thesis, Department of Mechanical Engineering, Georgia Institute of Technology
-
J. Rambo, "Reduced-order modeling of multiscale turbulent convection: Application to data center thermal management," Ph.D. Thesis, Department of Mechanical Engineering, Georgia Institute of Technology, 2006.
-
(2006)
-
-
Rambo, J.1
-
44
-
-
29644438541
-
Reduced order modeling of steady turbulent flows using the POD
-
Presented at, San Francisco, CA
-
.T. Rambo and Y. Joshi, "Reduced order modeling of steady turbulent flows using the POD," Presented at ASME Summer Heat Transfer Conference, San Francisco, CA, 2005.
-
(2005)
ASME Summer Heat Transfer Conference
-
-
Rambo, T.1
Joshi, Y.2
-
45
-
-
14844363626
-
Balance of power: Dynamic thermal management for internet data centers
-
R.K. Shaima, C.E. Bash, CD. Patel, R.J. Friedrich, and J.S. Chase, "Balance of power: Dynamic thermal management for internet data centers," IEEE Internet Computing, vol. 9, pp. 42-49, 2005.
-
(2005)
IEEE Internet Computing
, vol.9
, pp. 42-49
-
-
Shaima, R.K.1
Bash, C.E.2
Patel, C.D.3
Friedrich, R.J.4
Chase, J.S.5
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46
-
-
28144454593
-
Smart chip, system and data center enabled by advanced flexible cooling resources
-
Presented at
-
C.D. Patel, C.E. Bash, R. Sharma, A. Beitelmal, and C.G. Malone, "Smart chip, system and data center enabled by advanced flexible cooling resources," Presented at Twenty First Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2005.
-
(2005)
Twenty First Annual IEEE Semiconductor Thermal Measurement and Management Symposium
-
-
Patel, C.D.1
Bash, C.E.2
Sharma, R.3
Beitelmal, A.4
Malone, C.G.5
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50
-
-
4444291359
-
Viability of dynamic cooling control in a data center environment
-
Presented at, Las Vegas, NV
-
T.D. Boucher, D.M. Auslander, C.E. Bash, C.C. Federspiel, and C.D. Patel, "Viability of dynamic cooling control in a data center environment," Presented at ITHERM 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, 2004.
-
(2004)
ITHERM 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
-
-
Boucher, T.D.1
Auslander, D.M.2
Bash, C.E.3
Federspiel, C.C.4
Patel, C.D.5
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51
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0003987999
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New York: Cambridge University Press
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S.B. Pope, Turbulent Flows. New York: Cambridge University Press, 2000.
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(2000)
Turbulent Flows
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Pope, S.B.1
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54
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0035664177
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A turbulent plane jet impingment nearby and far from a flat plate
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S. Maurel and C. Solliec, "A turbulent plane jet impingment nearby and far from a flat plate," Experiments in Fluids, vol. 31, pp. 687-696, 2001.
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(2001)
Experiments in Fluids
, vol.31
, pp. 687-696
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Maurel, S.1
Solliec, C.2
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55
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0037268775
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Numerical simulation of heat transfer of turbulent impinging jets with two-equation turbulence models
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B. Merci, J. Vierendeels, C. DeLanghe, and E. Dick, "Numerical simulation of heat transfer of turbulent impinging jets with two-equation turbulence models," International Journal of Numerical Methods for Heat and Fluid Flow, vol. 13, pp. 110-132, 2002.
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(2002)
International Journal of Numerical Methods for Heat and Fluid Flow
, vol.13
, pp. 110-132
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Merci, B.1
Vierendeels, J.2
DeLanghe, C.3
Dick, E.4
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56
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0141683855
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Streamline upwind numerical simulation of two-dimensional confined impinging slot jets
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T.H. Park, H.G. Choi, J.Y. Yoo, and S.J. Kim, "Streamline upwind numerical simulation of two-dimensional confined impinging slot jets," International Journal of Heat and Mass Transfer, vol. 46, pp. 251-262, 2003.
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(2003)
International Journal of Heat and Mass Transfer
, vol.46
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Park, T.H.1
Choi, H.G.2
Yoo, J.Y.3
Kim, S.J.4
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57
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0028519373
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Modeling of a Single Confined Turbulent Slot Jet Impingment using Various k-s Turbulence Models
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Applied Mathematical Modeling
, vol.18
, pp. 526-537
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Seyedein, S.H.1
Majumdar, A.S.2
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58
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34247641390
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Airflow distribution through perforated tiles in close proximity to computer room air conditioning units
-
submitted
-
J. Rambo, G. Nelson, and Y. Joshi, "Airflow distribution through perforated tiles in close proximity to computer room air conditioning units," Presented at ASHRAE Symposia, 2006, submitted.
-
(2006)
Presented at ASHRAE Symposia
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Rambo, J.1
Nelson, G.2
Joshi, Y.3
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59
-
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0031336873
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Thermal characterization of chip packages - evolutionary design of compact models
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A. Bar-Cohen and W. Kraeger, "Thermal characterization of chip packages - evolutionary design of compact models," IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, vol. 20, pp. 399-410, 1997.
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(1997)
IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A
, vol.20
, pp. 399-410
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Bar-Cohen, A.1
Kraeger, W.2
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60
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13944278925
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Highlights from the european thermal project PROFIT
-
C. J.M. Lasance, "Highlights from the european thermal project PROFIT," ASME Journal of Electronic Packaging, vol. 126, pp. 565-570, 2004.
-
(2004)
ASME Journal of Electronic Packaging
, vol.126
, pp. 565-570
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Lasance, C.J.M.1
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61
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34247608443
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B. Shapiro, Creating reduced-order models for electronic systems: An overview and suggested use of existing model reduction and experimental system identification tools, in Thermal Challenges in Next Generation Electronics Systems, Y.K. Joshi and S.V. Garimella, Eds. Rotterdam, Netherlands: Millpress, 2002, pp. 299-306.
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B. Shapiro, "Creating reduced-order models for electronic systems: An overview and suggested use of existing model reduction and experimental system identification tools," in Thermal Challenges in Next Generation Electronics Systems, Y.K. Joshi and S.V. Garimella, Eds. Rotterdam, Netherlands: Millpress, 2002, pp. 299-306.
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62
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33845546978
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Reduced-order modeling of multiscale turbulent convection: Application to data center thermal management
-
Ph.D. Thesis, Department of Mechanical Engineering, Georgia Institute of Technology
-
J. Rambo, "Reduced-order modeling of multiscale turbulent convection: Application to data center thermal management" Ph.D. Thesis, Department of Mechanical Engineering, Georgia Institute of Technology, 2006.
-
(2006)
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-
Rambo, J.1
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63
-
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34247614707
-
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J. Rambo and Y. Joshi, POD analysis of steady flows with parametric boundary conditions, SIAM Journal of Scientific Computing, under review.
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J. Rambo and Y. Joshi, "POD analysis of steady flows with parametric boundary conditions," SIAM Journal of Scientific Computing, under review.
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65
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2442425416
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A thermal bus system for cooling electronic components in high-density cabinets
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M. Wilson, J. Wattelet, and K. Wert, "A thermal bus system for cooling electronic components in high-density cabinets," ASHRAE Transactions, pp. 567-573, 2004.
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(2004)
ASHRAE Transactions
, pp. 567-573
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Wilson, M.1
Wattelet, J.2
Wert, K.3
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66
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13344259268
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Improving the efficiency of cooling systems in data center considering equipment characteristics
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Presented at
-
Y. Furihata, H. Hayama, M. Enai, and T. Mori, "Improving the efficiency of cooling systems in data center considering equipment characteristics," Presented at INTELEC - 26th Annual International Telecommunications Energy Conference, 2004.
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(2004)
INTELEC - 26th Annual International Telecommunications Energy Conference
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-
Furihata, Y.1
Hayama, H.2
Enai, M.3
Mori, T.4
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68
-
-
20344388311
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Liquid cooling: Friend or foe?
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D.L. Beaty, "Liquid cooling: friend or foe?" ASHRAETransactions, pp. 643-652, 2004.
-
(2004)
ASHRAETransactions
, pp. 643-652
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-
Beaty, D.L.1
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69
-
-
4444297880
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Performance measurements of a force-convection air-cooled rack
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Presented at, Las Vegas, NV
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Y. Hwang, R. Radermacher, S. Spinazzola, and Z. Menachery, "Performance measurements of a force-convection air-cooled rack," Presented at THERM 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, 2004.
-
(2004)
THERM 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
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-
Hwang, Y.1
Radermacher, R.2
Spinazzola, S.3
Menachery, Z.4
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70
-
-
84950120815
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Modeling of air conditioning systems for cooling of data centers
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Presented at, San Diego, CA
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R. Anton, H. Jonsson, and B. Palm, "Modeling of air conditioning systems for cooling of data centers," Presented at ITHERM 2002 - Eight Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, 2002.
-
(2002)
ITHERM 2002 - Eight Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
-
-
Anton, R.1
Jonsson, H.2
Palm, B.3
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