A novel approach to low profile heat sink design

Journal of Heat Transfer

Volumn 132, Issue 9, 2010, Pages 1-8

  Stafford, Jason ^a   Walsh, Ed ^a   Egan, Vanessa ^a   Walsh, Pat ^a   Muzychka, Yuri S ^b  

^a UNIVERSITY OF LIMERICK   (Ireland)

^b MEMORIAL UNIVERSITY OF NEWFOUNDLAND   (Canada)

Author keywords

Electronic cooling; Forced convection; Heat exchangers

Indexed keywords

COOLING SOLUTIONS; ELECTRONIC COOLING; FORCED CONVECTION HEAT TRANSFER; HEAT SINK DESIGN; LOW PROFILE; SELECTION CRITERIA; THEORETICAL STUDY;

DESIGN; FORCED CONVECTION; HEAT SINKS;

COOLING;

EID: 77955297936     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.4001626     Document Type: Article

References (21)

1. Copeland, D., 2000, "Optimization of Parallel Plate Heatsinks for Forced Convection," Proceedings of the 16th IEEE Semi-Therm Symposium.
2. Xu, G., Guenin, B., and Vogel, M., 2004, "Extension of Air Cooling for High Power Processors," Proceedings of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), pp. 186-193.
3. Loh, C. K., Nelson, D., and Chou, D. J., 2001, "Thermal Characterization of Fan-Heat Sink Systems in Miniature Axial Fan and Micro Blower Airflow," Proceedings of the 17th IEEE Semi-Therm Symposium.
4. Copeland, D., 2005, "Review of Low Profile Cold Plate Technology for High Density Servers," Electronics Cooling, 11(2), pp. 14-18.
5. Walsh, E. J., and Grimes, R., 2007, "Low Profile Fan and Heat Sink Thermal Management Solution for Portable Applications," Int. J. Therm. Sci., 46, pp. 1182-1190.
6. Walsh, E., Walsh, P., Grimes, R., and Egan, V., 2008, "Thermal Management of Low Profile Electronic Equipment Using Radial Fans and Heat Sinks," J. Heat Transfer, 130(12), pp. 125001.
7. Egan, V., Walsh, P. A., Walsh, E., and Grimes, R., 2009, "Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins," J. Electron. Packag., 131(3), pp. 031004.
8. Egan, V., Stafford, J., Walsh, P. A., and Walsh, E., 2009, "An Experimental Study on the Design of Miniature Heat Sinks for Forced Convection Air Cooling," J. Heat Transfer, 131(7), pp. 071402.
9. Walsh, E. J., 2006, "High Temperature Electronics and Thermal Management-Low profile Thermal Management," Proceedings of the EPEC European Center for Power Electronics, Sud-West Park Conference Center, Nuremburg, Germany, Nov. 9-10.
10. Kays, W. M., and London, A. L., 1984, Compact Heat Exchangers, 3rd ed., McGraw-Hill, New York.
11. Muzychka, Y. S., and Yovanovich, M. M., 2004, "Laminar Forced Convection Heat Transfer in the Combined Entry Region of Non-Circular Ducts," ASME J. Heat Transfer, 126, pp. 54-61.
12. Stafford, J., Walsh, E., Egan, V., Walsh, P., and Muzychka, Y S., 2009, "An Experimental and Theoretical Study of Finned and Finless Heat Sinks for Low Profile Applications," Proceedings of the ASME Summer Heat Transfer Conference, San Francisco, CA.
13. 1998, Sunon B0535ADB2-8 DC Brushless Blower Specification, Issue Date 08/28/1998
14. 1980, BS848: Fans for General Purposes, Part 1: Methods for Testing Performance
15. Grimes, R., Walsh, E., Kunz, S., Davies, M., and Quin, D., 2003, "Scaling the Performance of Micro-Fans," Proceedings of the First International Conference on Mini-Microchannels, Rochester, New York.
16. Blieir, F. P., 1997, Fan Handbook: Selection, Application and Design, McGraw-Hill, New York.
17. Ellison, G. N., 1989, Thermal Computations for Electronic Equipment, Krieger Publishing Company, Malabar, FL.
18. Moffat, J. R., 1997, Uncertainty Analysis in Thermal Measurements in Electronics Cooling, K. Azar, ed., CRC, Boca Raton, FL, pp. 45-80.
19. Sparrow, E.M., 1955, "Analysis of Laminar Forced-Convection Heat Transfer in Entrance Region of Flat Rectangular Ducts," NACA Technical Paper No. 3331.
20. Churchill, S. W., and Usagi, R., 1972, "A General Expression for the Correlation of Rates of Transfer and Other Phenomena," AIChE J., 18, pp. 1121- 1128.
21. Bejan, A., and Sciubba, E., 1992, "The Optimal Spacing of Parallel Plates Cooled by Forced Convection," Int. J. Heat Mass Transfer, 35, pp. 3259-3264.