Chemical “kick start” for the autocatalytic formaldehyde-free electroless copper plating process

Circuit World

Volumn 36, Issue 2, 2010, Pages 20-23

  Steinhäuser, Edith ^a   Stamp, Lutz ^a   Brandt, Lutz ^a  

^a ATOTECH DEUTSCHLAND GMBH   (Germany)

Author keywords

Acids; Additives; Coating processes; Copper; Organic compounds

Indexed keywords

EID: 84986067903     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056121011041663     Document Type: Article

References (5)

1. Chowdhury, S. and Bauer, M. (2007), Electroless Plating Baths for High Aspect Features, US Patent 7220296 B1, US Patents Office, Washington, DC.
2. Lau, P.P., Wong, C.C. and Chan, L. (2006), “Improving electroless Cu via filling with optimised Pd activation”, Applied Surface Science, Vol. 253, pp. 2357-61.
3. Li, J. and Kohl, P.A. (2003), “The deposition characteristics of accelerated non-formaldehyde electroless copper plating”, J. Electro. Soc., Vol. 150.
4. Schoenberg, L.N. (1972), “The use of organic additives to stabilize and enhance the deposition rate of electroless copper plating”, J. Electro. Soc., Vol. 119 No. 11, p. 1972.
5. Stein, L. (1992), Formaldehydfreies Bad zur stromlosen Abscheidung von Kupfer und Verfahren unter Verwendung dieses Bades, DE 4111558 C1.